Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11557421 | Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method | Marcel Wieland, Hartmuth Daniel Kunze, Lothar Lehmann, Sven Bedürftig, Patrick Rohlfs | 2023-01-17 |
| 7977160 | Semiconductor devices having stress relief layers and methods for fabricating the same | Michael Z. Su, Lei Fu | 2011-07-12 |