| 12334455 |
Semiconductor package with integrated capacitors |
Michael Z. Su, Siddharth Ravichandran |
2025-06-17 |
| 12288756 |
Semiconductor package with integrated capacitors |
Michael Z. Su, Siddharth Ravichandran |
2025-04-29 |
| 11830817 |
Creating interconnects between dies using a cross-over die and through-die vias |
Rahul Agarwal, Raja Swaminathan, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more |
2023-11-28 |
| 10290606 |
Interposer with identification system |
Joe Siegel, Michael Z. Su, Bryan Black, Julius Din |
2019-05-14 |
| 9806014 |
Interposer with beyond reticle field conductor pads |
Bryan Black, Michael Z. Su, Joseph Siegel, Julius Din, Anwar Kashem |
2017-10-31 |
| 9793239 |
Semiconductor workpiece with selective backside metallization |
Michael Z. Su, Bryan Black |
2017-10-17 |
| 8704353 |
Thermal management of stacked semiconductor chips with electrically non-functional interconnects |
Michael Z. Su, Bryan Black, Neil McLellan, Joe Siegel |
2014-04-22 |