Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334455 | Semiconductor package with integrated capacitors | Michael Z. Su, Siddharth Ravichandran | 2025-06-17 |
| 12288756 | Semiconductor package with integrated capacitors | Michael Z. Su, Siddharth Ravichandran | 2025-04-29 |
| 11830817 | Creating interconnects between dies using a cross-over die and through-die vias | Rahul Agarwal, Raja Swaminathan, Gabriel H. Loh, Alan D. Smith, Gabriel Wong +1 more | 2023-11-28 |
| 10290606 | Interposer with identification system | Joe Siegel, Michael Z. Su, Bryan Black, Julius Din | 2019-05-14 |
| 9806014 | Interposer with beyond reticle field conductor pads | Bryan Black, Michael Z. Su, Joseph Siegel, Julius Din, Anwar Kashem | 2017-10-31 |
| 9793239 | Semiconductor workpiece with selective backside metallization | Michael Z. Su, Bryan Black | 2017-10-17 |
| 8704353 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Michael Z. Su, Bryan Black, Neil McLellan, Joe Siegel | 2014-04-22 |