Issued Patents All Time
Showing 25 most recent of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12430346 | Systems and methods for automatic clustering and canonical designation of related data in various data structures | Lawrence Manning, Rahul Mehta, Daniel Erenrich, Guillem Palou Visa, Roger Hu +11 more | 2025-09-30 |
| 12424560 | Semiconductor chip device | Chia-Hao Cheng, Kong-Toon Ng, Brett P. Wilkerson | 2025-09-23 |
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Priyal Shah, Milind S. Bhagavat, Chia-Hao Cheng | 2025-08-19 |
| 12390170 | Methods and systems for controlling a left ventricular assist device | Allison Connolly, Yelena Nabutovsky, Julie Prillinger | 2025-08-19 |
| 12381127 | Semiconductor chip device integrating thermal pipes in three-dimensional packaging | Raja Swaminathan | 2025-08-05 |
| 12334488 | Stacking power delivery device dies | Arsalan Alam, Fei Guo | 2025-06-17 |
| 12301945 | Systems and methods for media streaming application interacting with a social network | — | 2025-05-13 |
| 12276850 | Fanout module integrating a photonic integrated circuit | Brett P. Wilkerson, Raja Swaminathan, Kong-Toon Ng | 2025-04-15 |
| 12266611 | Mixed density interconnect architectures using hybrid fan-out | Brett P. Wilkerson, Raja Swaminathan | 2025-04-01 |
| 12249519 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu | 2025-03-11 |
| 12237286 | High-speed die connections using a conductive insert | — | 2025-02-25 |
| 12183675 | Fan-out packages with warpage resistance | Chia-Hao Cheng, Milind S. Bhagavat | 2024-12-31 |
| 12174800 | Model object management and storage system | David Lisuk, Daniel Erenrich, Guodong Xu, Luis Voloch, Simon Slowik +4 more | 2024-12-24 |
| 12170263 | Fabricating active-bridge-coupled GPU chiplets | Skyler Jonathon Saleh, Ruijin Wu, Milind S. Bhagavat | 2024-12-17 |
| 12165981 | 3D semiconductor package with die-mounted voltage regulator | Gabriel H. Loh, Raja Swaminathan, Brett P. Wilkerson | 2024-12-10 |
| 12107075 | Hybrid bonded interconnect bridging | Lei Fu, Brett P. Wilkerson | 2024-10-01 |
| 12095769 | Expedited authorization and connectivity of client devices | Vikram Limaye | 2024-09-17 |
| 12080632 | Glass core package substrates | Deepak Kulkarni, Rajasekaran Swaminathan, Chintan Buch | 2024-09-03 |
| 12067469 | System and method for machine learning-based delivery tagging | Omker Mahalanobish, Nicholas William Sinai, Girish Thiruvenkadam | 2024-08-20 |
| 12056718 | Fraud lead detection system for efficiently processing database-stored data and automatically generating natural language explanatory information of system results for display in interactive user interfaces | Diane Wu | 2024-08-06 |
| 12038933 | Systems and methods for automatic clustering and canonical designation of related data in various data structures | Lawrence Manning, Rahul Mehta, Daniel Erenrich, Guillem Palou Visa, Roger Hu +11 more | 2024-07-16 |
| 11911839 | Low temperature hybrid bonding | Priyal Shah, Raja Swaminathan, Brett P. Wilkerson | 2024-02-27 |
| 11907175 | Model object management and storage system | David Lisuk, Daniel Erenrich, Guodong Xu, Luis Voloch, Simon Slowik +4 more | 2024-02-20 |
| 11853788 | Managed virtual appliances | Steven Taylor, Etienne Robert Le Sueur, Sindhu Shashidhara, Sunny Tulsi Sreedhar Murthy, Gal Yardeni +1 more | 2023-12-26 |
| 11855061 | Offset-aligned three-dimensional integrated circuit | Brett P. Wilkerson, Milind S. Bhagavat, Dmitri Yudanov | 2023-12-26 |