| 12430346 |
Systems and methods for automatic clustering and canonical designation of related data in various data structures |
Lawrence Manning, Rahul Mehta, Daniel Erenrich, Guillem Palou Visa, Roger Hu +11 more |
2025-09-30 |
|
| 12424560 |
Semiconductor chip device |
Chia-Hao Cheng, Kong-Toon Ng, Brett P. Wilkerson |
2025-09-23 |
|
| 12394683 |
Molded semiconductor chip package with stair-step molding layer |
Priyal Shah, Milind S. Bhagavat, Chia-Hao Cheng |
2025-08-19 |
|
| 12390170 |
Methods and systems for controlling a left ventricular assist device |
Allison Connolly, Yelena Nabutovsky, Julie Prillinger |
2025-08-19 |
|
| 12381127 |
Semiconductor chip device integrating thermal pipes in three-dimensional packaging |
Raja Swaminathan |
2025-08-05 |
|
| 12334488 |
Stacking power delivery device dies |
Arsalan Alam, Fei Guo |
2025-06-17 |
|
| 12301945 |
Systems and methods for media streaming application interacting with a social network |
— |
2025-05-13 |
|
| 12276850 |
Fanout module integrating a photonic integrated circuit |
Brett P. Wilkerson, Raja Swaminathan, Kong-Toon Ng |
2025-04-15 |
|
| 12266611 |
Mixed density interconnect architectures using hybrid fan-out |
Brett P. Wilkerson, Raja Swaminathan |
2025-04-01 |
|
| 12249519 |
Molded chip package with anchor structures |
Priyal Shah, Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu |
2025-03-11 |
|
| 12237286 |
High-speed die connections using a conductive insert |
— |
2025-02-25 |
|
| 12183675 |
Fan-out packages with warpage resistance |
Chia-Hao Cheng, Milind S. Bhagavat |
2024-12-31 |
$219,663,000 |
| 12174800 |
Model object management and storage system |
David Lisuk, Daniel Erenrich, Guodong Xu, Luis Voloch, Simon Slowik +4 more |
2024-12-24 |
|
| 12170263 |
Fabricating active-bridge-coupled GPU chiplets |
Skyler Jonathon Saleh, Ruijin Wu, Milind S. Bhagavat |
2024-12-17 |
$286,725,000 |
| 12165981 |
3D semiconductor package with die-mounted voltage regulator |
Gabriel H. Loh, Raja Swaminathan, Brett P. Wilkerson |
2024-12-10 |
$237,856,000 |
| 12107075 |
Hybrid bonded interconnect bridging |
Lei Fu, Brett P. Wilkerson |
2024-10-01 |
$299,271,000 |
| 12095769 |
Expedited authorization and connectivity of client devices |
Vikram Limaye |
2024-09-17 |
$6,734,000 |
| 12080632 |
Glass core package substrates |
Deepak Kulkarni, Rajasekaran Swaminathan, Chintan Buch |
2024-09-03 |
$326,917,000 |
| 12067469 |
System and method for machine learning-based delivery tagging |
Omker Mahalanobish, Nicholas William Sinai, Girish Thiruvenkadam |
2024-08-20 |
|
| 12056718 |
Fraud lead detection system for efficiently processing database-stored data and automatically generating natural language explanatory information of system results for display in interactive user interfaces |
Diane Wu |
2024-08-06 |
|
| 12038933 |
Systems and methods for automatic clustering and canonical designation of related data in various data structures |
Lawrence Manning, Rahul Mehta, Daniel Erenrich, Guillem Palou Visa, Roger Hu +11 more |
2024-07-16 |
|
| 11911839 |
Low temperature hybrid bonding |
Priyal Shah, Raja Swaminathan, Brett P. Wilkerson |
2024-02-27 |
$534,247,000 |
| 11907175 |
Model object management and storage system |
David Lisuk, Daniel Erenrich, Guodong Xu, Luis Voloch, Simon Slowik +4 more |
2024-02-20 |
|
| 11853788 |
Managed virtual appliances |
Steven Taylor, Etienne Robert Le Sueur, Sindhu Shashidhara, Sunny Tulsi Sreedhar Murthy, Gal Yardeni +1 more |
2023-12-26 |
|
| 11855061 |
Offset-aligned three-dimensional integrated circuit |
Brett P. Wilkerson, Milind S. Bhagavat, Dmitri Yudanov |
2023-12-26 |
$301,983,000 |
