Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Low temperature hybrid bonding

Low temperature hybrid bonding

US Patent 11911839 · Granted Feb 27, 2024

Estimated economic value: $534,247,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for automatic clustering and canonical designation of relate2025
Semiconductor chip device2025
Semiconductor chip device2025
Methods and systems for controlling a left ventricular assist device2025
Molded semiconductor chip package with stair-step molding layer2025
Molded semiconductor chip package with stair-step molding layer2025
Semiconductor chip device integrating thermal pipes in three-dimensional packagi2025
Semiconductor chip device integrating thermal pipes in three-dimensional packagi2025
Electronic device including dies and an interconnect coupled to the dies and pro2025
Electronic device including dies and an interconnect coupled to the dies and pro2025
Stacking power delivery device dies2025
Systems and methods for media streaming application interacting with a social ne2025