Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394683 | Molded semiconductor chip package with stair-step molding layer | Rahul Agarwal, Milind S. Bhagavat, Chia-Hao Cheng | 2025-08-19 |
| 12278150 | Semiconductor package with annular package lid structure | Brett P. Wilkerson, Raja Swaminathan | 2025-04-15 |
| 12249519 | Molded chip package with anchor structures | Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2025-03-11 |
| 11911839 | Low temperature hybrid bonding | Rahul Agarwal, Raja Swaminathan, Brett P. Wilkerson | 2024-02-27 |
| 11810891 | Bond pads for low temperature hybrid bonding | Milind S. Bhagavat | 2023-11-07 |
| 11742301 | Fan-out package with reinforcing rivets | Rahul Agarwal, Milind S. Bhagavat, Chia-Hao Cheng, Brett P. Wilkerson, Lei Fu | 2023-08-29 |
| 11676924 | Semiconductor chip with reduced pitch conductive pillars | Milind S. Bhagavat, Lei Fu | 2023-06-13 |
| 11367628 | Molded chip package with anchor structures | Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2022-06-21 |
| 10943880 | Semiconductor chip with reduced pitch conductive pillars | Milind S. Bhagavat, Lei Fu | 2021-03-09 |
| 10937755 | Bond pads for low temperature hybrid bonding | Milind S. Bhagavat | 2021-03-02 |
| 10593620 | Fan-out package with multi-layer redistribution layer structure | Rahul Agarwal, Milind S. Bhagavat | 2020-03-17 |