Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412740 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2025-09-09 |
| 12249504 | Manufacturing and reuse of semiconductor substrates | Bernhard Goller, Alexander Binter, Martin Huber, Iris Moder, Matteo Piccin +2 more | 2025-03-11 |
| 11887894 | Methods for processing a wide band gap semiconductor wafer using a support layer and methods for forming a plurality of thin wide band gap semiconductor wafers using support layers | Francisco Javier Santos Rodriguez, Günter Denifl, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2024-01-30 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |
| 11721547 | Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device | Christian Hecht, Roland Rupp, Hans-Joachim Schulze | 2023-08-08 |
| 11576259 | Carrier, laminate and method of manufacturing semiconductor devices | Hans-Joachim Schulze, Andre Brockmeier, Gerhard Metzger-Brueckl, Matteo Piccin, Francisco Javier Santos Rodriguez | 2023-02-07 |
| 11557506 | Methods for processing a semiconductor substrate | Werner Schustereder, Alexander Breymesser, Mihai Draghici, Wolfgang Lehnert, Hans-Joachim Schulze +1 more | 2023-01-17 |
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Bernhard Goller, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-10-18 |
| 11373863 | Method of manufacturing a silicon carbide device and wafer composite including laser modified zones in a handle substrate | Roland Rupp, Mihai Draghici, Wolfgang Lehnert, Matteo Piccin | 2022-06-28 |
| 11107732 | Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafers | Francisco Javier Santos Rodriguez, Guenter Denifl, Martin Huber, Wolfgang Lehnert, Roland Rupp +1 more | 2021-08-31 |
| 10903078 | Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Guenter Denifl, Mihai Draghici, Bernhard Goller +3 more | 2021-01-26 |