| 12412740 |
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device |
Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze |
2025-09-09 |
| 12249504 |
Manufacturing and reuse of semiconductor substrates |
Bernhard Goller, Alexander Binter, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Matteo Piccin +2 more |
2025-03-11 |
| 12107130 |
Semiconductor device having semiconductor device elements in a semiconductor layer |
Ingo Muri, Johannes Baumgartl, Oliver Hellmund, Jacob Tillmann Ludwig, Thomas Neidhart +2 more |
2024-10-01 |
| 11881397 |
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device |
Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze |
2024-01-23 |
| 11810779 |
Method of porosifying part of a semiconductor wafer |
Sophia Friedler, Bernhard Goller, Ingo Muri |
2023-11-07 |
| 11476111 |
Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device |
Bernhard Goller, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze |
2022-10-18 |
| 11404262 |
Method for partially removing a semiconductor wafer |
Sophia Friedler, Bernhard Goller, Ingo Muri |
2022-08-02 |
| 11373857 |
Semiconductor surface smoothing and semiconductor arrangement |
Bernhard Goller, Petra Fischer |
2022-06-28 |
| 11342433 |
Silicon carbide devices, semiconductor devices and methods for forming silicon carbide devices and semiconductor devices |
Ralf Siemieniec, Thomas Aichinger, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Carsten von Koblinski |
2022-05-24 |
| 11038028 |
Semiconductor device and manufacturing method |
Ingo Muri, Johannes Baumgartl, Oliver Hellmund, Jacob Tillmann Ludwig, Thomas Neidhart +2 more |
2021-06-15 |
| 11011409 |
Devices with backside metal structures and methods of formation thereof |
Oliver Hellmund, Ingo Muri, Johannes Baumgartl, Thomas Neidhart, Hans-Joachim Schulze |
2021-05-18 |
| 10802404 |
Reticle and exposure method including projection of a reticle pattern into neighboring exposure fields |
Joerg Ortner, Ingo Muri |
2020-10-13 |
| 10714377 |
Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing |
Ingo Muri, Bernhard Goller, Hans-Joachim Schulze |
2020-07-14 |
| 10535553 |
Devices with backside metal structures and methods of formation thereof |
Oliver Hellmund, Ingo Muri, Johannes Baumgartl, Thomas Neidhart, Hans-Joachim Schulze |
2020-01-14 |
| 10497583 |
Method for manufacturing a semiconductor device comprising etching a semiconductor material |
Sophia Friedler, Ingo Muri, Hans-Joachim Schulze |
2019-12-03 |
| 10325804 |
Method of wafer thinning and realizing backside metal structures |
Oliver Hellmund, Johannes Baumgartl, Ingo Muri, Thomas Neidhart, Hans-Joachim Schulze |
2019-06-18 |
| 10199372 |
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures |
Ingo Muri, Oliver Hellmund, Johannes Baumgartl, Annette Saenger, Barbara Eichinger +2 more |
2019-02-05 |
| 10074566 |
Semiconductor device and methods for forming a plurality of semiconductor devices |
Johannes Baumgartl, Manfred Engelhardt, Oliver Hellmund, Ingo Muri |
2018-09-11 |
| 10049914 |
Method for thinning substrates |
Roland Rupp, Hans-Joachim Schulze, Francisco Javier Santos Rodriguez, Ingo Muri |
2018-08-14 |
| 9960076 |
Devices with backside metal structures and methods of formation thereof |
Oliver Hellmund, Ingo Muri, Johannes Baumgartl, Thomas Neidhart, Hans-Joachim Schulze |
2018-05-01 |
| 9954065 |
Method of forming a semiconductor device and semiconductor device |
Anton Mauder, Frank Pfirsch, Hans-Joachim Schulze, Ingo Muri, Johannes Baumgartl |
2018-04-24 |
| 9875926 |
Substrates with buried isolation layers and methods of formation thereof |
Ingo Muri, Johannes Baumgartl, Oliver Hellmund, Manfred Engelhardt, Hans-Joachim Schulze |
2018-01-23 |
| 9472395 |
Semiconductor arrangement including buried anodic oxide and manufacturing method |
Hans-Joachim Schulze, Ingo Muri |
2016-10-18 |
