Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412740 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2025-09-09 |
| 12249504 | Manufacturing and reuse of semiconductor substrates | Alexander Binter, Tobias Franz Wolfgang Hoechbauer, Martin Huber, Iris Moder, Matteo Piccin +2 more | 2025-03-11 |
| 12211703 | Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layer | Hans-Joachim Schulze, Alexander Breymesser, Matthias Kuenle, Helmut Oefner, Francisco Javier Santos Rodriguez +1 more | 2025-01-28 |
| 12060266 | Method with mechanical dicing process for producing MEMS components | Andre Brockmeier, Markus Bergmeister, Daniel Pieber, Sokratis Sgouridis | 2024-08-13 |
| 11881397 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2024-01-23 |
| 11810779 | Method of porosifying part of a semiconductor wafer | Sophia Friedler, Iris Moder, Ingo Muri | 2023-11-07 |
| 11742215 | Methods for forming a semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Matthias Kuenle, Helmut Oefner, Francisco Javier Santos Rodriguez +1 more | 2023-08-29 |
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Wolfgang Diewald, Heimo Graf, Gerald Lackner +4 more | 2023-08-01 |
| 11476111 | Semiconductor device with a porous portion, wafer composite and method of manufacturing a semiconductor device | Iris Moder, Tobias Franz Wolfgang Hoechbauer, Roland Rupp, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze | 2022-10-18 |
| 11404262 | Method for partially removing a semiconductor wafer | Sophia Friedler, Iris Moder, Ingo Muri | 2022-08-02 |
| 11373857 | Semiconductor surface smoothing and semiconductor arrangement | Iris Moder, Petra Fischer | 2022-06-28 |
| 11328955 | Semiconductor chip including back-side conductive layer | Ingo Muri | 2022-05-10 |
| 11139375 | Semiconductor device and method of manufacturing a semiconductor device | Carsten Schaeffer, Alexander Breymesser, Ronny Kern, Matteo Piccin, Roland Rupp +1 more | 2021-10-05 |
| 11088009 | Support table, support table assembly, processing arrangement, and methods thereof | Walter Leitgeb, Daniel J. Brunner, Lukas Ferlan, Markus Ottowitz | 2021-08-10 |
| 11031466 | Method of forming oxygen inserted Si-layers in power semiconductor devices | Martin Poelzl, Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser +1 more | 2021-06-08 |
| 10903078 | Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor device | Hans-Joachim Schulze, Alexander Breymesser, Guenter Denifl, Mihai Draghici, Tobias Franz Wolfgang Hoechbauer +3 more | 2021-01-26 |
| 10868172 | Vertical power devices with oxygen inserted Si-layers | Oliver Blank, Thomas Feil, Maximilian Roesch, Martin Poelzl, Robert Haase +2 more | 2020-12-15 |
| 10861966 | Vertical trench power devices with oxygen inserted Si-layers | Thomas Feil, Robert Haase, Martin Poelzl, Maximilian Roesch, Sylvain Leomant +1 more | 2020-12-08 |
| 10784161 | Semiconductor chip including self-aligned, back-side conductive layer and method for making the same | Ingo Muri | 2020-09-22 |
| 10749216 | Battery, integrated circuit and method of manufacturing a battery | Ravi Keshav Joshi, Alexander Breymesser, Kamil Karlovsky, Francisco Javier Santos Rodriguez, Peter Zorn | 2020-08-18 |
| 10741638 | Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices | Martin Poelzl, Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser +1 more | 2020-08-11 |
| 10714377 | Semiconductor device and semiconductor wafer including a porous layer and method of manufacturing | Ingo Muri, Iris Moder, Hans-Joachim Schulze | 2020-07-14 |
| 10580888 | Oxygen inserted Si-layers for reduced contact implant outdiffusion in vertical power devices | Oliver Blank, Thomas Feil, Maximilian Roesch, Martin Poelzl, Robert Haase +2 more | 2020-03-03 |
| 10573742 | Oxygen inserted Si-layers in vertical trench power devices | Thomas Feil, Robert Haase, Martin Poelzl, Maximilian Roesch, Sylvain Leomant +1 more | 2020-02-25 |
| 10530018 | Panel, a method for fabricating a panel and a method | Denis Lenardic, Katharina Schmut | 2020-01-07 |