Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060266 | Method with mechanical dicing process for producing MEMS components | Andre Brockmeier, Markus Bergmeister, Bernhard Goller, Sokratis Sgouridis | 2024-08-13 |
| 11610817 | Method of processing a semiconductor wafer, semiconductor wafer, and semiconductor die produced from a semiconductor wafer | Andreas Kitzler, John Cooper, Jakob Simon Dohr, Michael Knabl, Matic Krivec | 2023-03-21 |