Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11712749 | Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devices | Ralf Rieske, Alexander Binter, Bernhard Goller, Heimo Graf, Gerald Lackner +4 more | 2023-08-01 |
| 6764954 | Application of alignment marks to wafer | Klaus Mummler | 2004-07-20 |
| 6277761 | Method for fabricating stacked vias | Detlef Weber | 2001-08-21 |
| 6257955 | Apparatus and method for heating a liquid or viscous polishing agent, and device for polishing wafers | Gotz Springer, Andre Richter | 2001-07-10 |