Issued Patents All Time
Showing 1–25 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119400 | Semiconductor transistor device and method of manufacturing the same | Robert Haase, Jyotshna Bhandari, Heimo Hofer, Ling Ma, Ashita Mirchandani +3 more | 2024-10-15 |
| 12087717 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Paul Ganitzer, Carsten von Koblinski | 2024-09-10 |
| 12080789 | Semiconductor die and method of manufacturing the same | Oliver Blank, Heimo Hofer, Andreas Kleinbichler | 2024-09-03 |
| 11848237 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2023-12-19 |
| 11699725 | Semiconductor device having an alignment layer with mask pits | Oliver Blank, Franz Hirler, Maximilian Roesch, Li Juin Yip | 2023-07-11 |
| 11552016 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2023-01-10 |
| 11545545 | Superjunction device with oxygen inserted Si-layers | Robert Haase, Sylvain Leomant, Maximilian Roesch, Ravi Keshav Joshi, Andreas Meiser +2 more | 2023-01-03 |
| 11316043 | Semiconductor transistor device and method of manufacturing the same | Robert Haase, Jyotshna Bhandari, Heimo Hofer, Ling Ma, Ashita Mirchandani +3 more | 2022-04-26 |
| 11302579 | Composite wafer, semiconductor device and electronic component | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2022-04-12 |
| 11081457 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Paul Ganitzer, Carsten von Koblinski | 2021-08-03 |
| 11031478 | Semiconductor device having body contacts with dielectric spacers and corresponding methods of manufacture | Wei Huang, Thomas Feil, Maximilian Roesch | 2021-06-08 |
| 11031466 | Method of forming oxygen inserted Si-layers in power semiconductor devices | Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser, Bernhard Goller +1 more | 2021-06-08 |
| 10991812 | Transistor device with a rectifier element between a field electrode and a source electrode | Ralf Siemieniec, Robert Haase, Gerhard Noebauer | 2021-04-27 |
| 10971449 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2021-04-06 |
| 10903321 | Semiconductor device and method of manufacturing a semiconductor device using an alignment layer | Oliver Blank, Franz Hirler, Maximilian Roesch, Li Juin Yip | 2021-01-26 |
| 10868172 | Vertical power devices with oxygen inserted Si-layers | Oliver Blank, Thomas Feil, Maximilian Roesch, Robert Haase, Sylvain Leomant +2 more | 2020-12-15 |
| 10861966 | Vertical trench power devices with oxygen inserted Si-layers | Thomas Feil, Robert Haase, Maximilian Roesch, Sylvain Leomant, Bernhard Goller +1 more | 2020-12-08 |
| 10790353 | Semiconductor device with superjunction and oxygen inserted Si-layers | Robert Haase, Sylvain Leomant, Maximilian Roesch, Ravi Keshav Joshi, Andreas Meiser +2 more | 2020-09-29 |
| 10741638 | Oxygen inserted Si-layers for reduced substrate dopant outdiffusion in power devices | Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser, Bernhard Goller +1 more | 2020-08-11 |
| 10672664 | Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device | Paul Ganitzer, Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller +1 more | 2020-06-02 |
| 10593623 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Paul Ganitzer | 2020-03-17 |
| 10580888 | Oxygen inserted Si-layers for reduced contact implant outdiffusion in vertical power devices | Oliver Blank, Thomas Feil, Maximilian Roesch, Robert Haase, Sylvain Leomant +2 more | 2020-03-03 |
| 10573742 | Oxygen inserted Si-layers in vertical trench power devices | Thomas Feil, Robert Haase, Maximilian Roesch, Sylvain Leomant, Bernhard Goller +1 more | 2020-02-25 |
| 10510836 | Gate trench device with oxygen inserted si-layers | Robert Haase, Maximilian Roesch, Sylvain Leomant, Andreas Meiser | 2019-12-17 |
| 10355087 | Semiconductor device including a transistor with a gate dielectric having a variable thickness | Martin Vielemeyer, Andreas Meiser, Till Schloesser, Franz Hirler | 2019-07-16 |