Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087717 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Martin Poelzl, Carsten von Koblinski | 2024-09-10 |
| 11848237 | Composite wafer, semiconductor device and electronic component | Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl +1 more | 2023-12-19 |
| 11552016 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Martin Poelzl | 2023-01-10 |
| 11302579 | Composite wafer, semiconductor device and electronic component | Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl +1 more | 2022-04-12 |
| 11081457 | Semiconductor package and methods of manufacturing a semiconductor package | Thomas Feil, Danny Clavette, Martin Poelzl, Carsten von Koblinski | 2021-08-03 |
| 10971449 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Martin Poelzl | 2021-04-06 |
| 10672664 | Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor device | Carsten von Koblinski, Thomas Feil, Gerald Lackner, Jochen Mueller, Martin Poelzl +1 more | 2020-06-02 |
| 10593623 | Semiconductor device with metallization structure on opposite sides of a semiconductor portion | Martin Poelzl | 2020-03-17 |
| 10573533 | Method of reducing a sheet resistance in an electronic device, and an electronic device | Edward Fuergut, Irmgard Escher-Poeppel, Stephanie Fassl, Gerhard Poeppel, Werner Schustereder +1 more | 2020-02-25 |
| 9935055 | Methods of manufacturing a semiconductor device by forming a separation trench | Andreas Meiser, Markus Zundel, Martin Poelzl, Georg Ehrentraut | 2018-04-03 |
| 9887152 | Method for manufacturing semiconductor devices having a metallisation layer | Rudolf Zelsacher | 2018-02-06 |
| 9673157 | Processing of thick metal pads | Rudolf Zelsacher | 2017-06-06 |
| 9461004 | Semiconductor workpiece having a semiconductor substrate with at least two chip areas | Andreas Meiser, Markus Zundel, Martin Poelzl, Georg Ehrentraut | 2016-10-04 |
| 9397055 | Processing of thick metal pads | Rudolf Zelsacher | 2016-07-19 |
| 9070741 | Method of manufacturing a semiconductor device and a semiconductor workpiece | Andreas Meiser, Markus Zundel, Martin Poelzl, Georg Ehrentraut | 2015-06-30 |
| 9029200 | Method for manufacturing semiconductor devices having a metallisation layer | Rudolf Zelsacher | 2015-05-12 |
| 9030028 | Method for manufacturing semiconductor devices having a metallisation layer | Rudolf Zelsacher | 2015-05-12 |
| 9006899 | Layer stack | Kurt Matoy, Martin Sporn, Mark Harrison | 2015-04-14 |
| 8710678 | Device and method including a soldering process | Francisco Javier Santos Rodriguez, Martin Sporn, Daniel Kraft | 2014-04-29 |
| 8603858 | Method for manufacturing a semiconductor package | Martin Standing | 2013-12-10 |
| 8324115 | Semiconductor chip, semiconductor device and methods for producing the same | Ralf Otremba, Daniel Kraft, Alexander Komposch, Hannes Eder, Stefan Woehlert | 2012-12-04 |
| 8211752 | Device and method including a soldering process | Francisco Javier Santos Rodriguez, Martin Sporn, Daniel Kraft | 2012-07-03 |
| 7851349 | Method for producing a connection electrode for two semiconductor zones arranged one above another | Walter Rieger, Oliver Haeberlen, Franz Hirler, Markus Zundel, Rudolf Zelsacher +1 more | 2010-12-14 |