Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020285 | Method of producing a semiconductor device and a semiconductor device | Edward Fuergut, Manfred Engelhardt, Bernd Roemer | 2018-07-10 |
| 9627287 | Thinning in package using separation structure as stop | Manfred Engelhardt, Edward Fuergut | 2017-04-18 |
| 9576875 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Gunther Mackh +1 more | 2017-02-21 |
| 9275916 | Removable indicator structure in electronic chips of a common substrate for process adjustment | Edward Fuergut, Irmgard Escher-Poeppel, Manfred Engelhardt, Hans-Joerg Timme | 2016-03-01 |
| 8951915 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Gunther Mackh +1 more | 2015-02-10 |
| 8637379 | Device including a semiconductor chip and a carrier and fabrication method | Ivan Nikitin, Manfred Schneegans, Jens Goerlich, Karsten Guth, Alexander Heinrich | 2014-01-28 |
| 8324115 | Semiconductor chip, semiconductor device and methods for producing the same | Ralf Otremba, Daniel Kraft, Alexander Komposch, Paul Ganitzer, Stefan Woehlert | 2012-12-04 |