Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424495 | Chip separation supported by back side trench and adhesive therein | Martin Brandl | 2025-09-23 |
| 12406940 | Semiconductor chip having a crack stop structure | Sergey Ananiev, Andreas Bauer, Michael Goroll, Maria Heidenblut, Stefan Kaiser +3 more | 2025-09-02 |
| 12374632 | Semiconductor device and method for manufacturing a plurality of semiconductive devices | Martin Brandl, Bernhard Drummer | 2025-07-29 |
| 10748801 | Carrier arrangement and method for processing a carrier by generating a crack structure | Markus Brunnbauer, Adolf Koller, Jochen Mueller | 2020-08-18 |
| 10600701 | Wafer and method for processing a wafer | Gerhard Leschik, Maria Heidenblut | 2020-03-24 |
| 10090214 | Wafer and method for processing a wafer | Gerhard Leschik, Maria Heidenblut | 2018-10-02 |
| 10008318 | System and method for integrated inductor | Carsten Ahrens, Klemens Pruegl | 2018-06-26 |
| 9911655 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Bernhard Drummer, Korbinian Kaspar | 2018-03-06 |
| 9576875 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Hannes Eder +1 more | 2017-02-21 |
| 9570352 | Method of dicing a wafer and semiconductor chip | Markus Brunnbauer, Bernhard Drummer, Korbinian Kaspar | 2017-02-14 |
| 9196670 | Through substrate features in semiconductor substrates | Uwe Siedel, Rainer Leuschner | 2015-11-24 |
| 9159620 | Semiconductor structure and method for making same | Uwe Seidel, Rainer Leuschner | 2015-10-13 |
| 9147624 | Chip comprising a backside metal stack | Adolf Koller | 2015-09-29 |
| 9040389 | Singulation processes | Maria Heidenblut, Adolf Koller, Anatoly Sotnikov | 2015-05-26 |
| 9040354 | Chip comprising a fill structure | Gerhard Leschik, Adolf Koller, Harald Seidl | 2015-05-26 |
| 8951915 | Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements | Reinhard Hess, Katharina Umminger, Gabriel Maier, Markus Menath, Hannes Eder +1 more | 2015-02-10 |
| 8822329 | Method for making conductive interconnects | Rainer Leuschner, Uwe Seidel | 2014-09-02 |
| 8809165 | Method for fusing a laser fuse and method for processing a wafer | Gerhard Leschik | 2014-08-19 |
| 8785234 | Method for manufacturing a plurality of chips | Adolf Koller | 2014-07-22 |
| 8704338 | Chip comprising a fill structure | Gerhard Leschik, Adolf Koller, Harald Seidl | 2014-04-22 |
| 8697574 | Through substrate features in semiconductor substrates | Uwe Seidel, Rainer Leuschner | 2014-04-15 |
| 8436707 | System and method for integrated inductor | Carsten Ahrens, Klemens Pruegl | 2013-05-07 |
| 7816791 | Bonding pad for contacting a device | Carsten Ahrens, Sven Albers, Klaus Gnannt, Ulrich Krumbein, Patrick Schelauske +2 more | 2010-10-19 |
| 7660175 | Integrated circuit, method for acquiring data and measurement system | Dieter Kohlert, Erhard Sixt, Rainer Holmer, Georg Seidemann, Berthold Schuderer +4 more | 2010-02-09 |
| 7202527 | MOS transistor and ESD protective device each having a settable voltage ratio of the lateral breakdown voltage to the vertical breakdown voltage | Kai Esmark, Harald Gossner, Richard Owen, Franz Zangl | 2007-04-10 |