US

Uwe Seidel

Infineon Technologies Ag: 18 patents #440 of 7,486Top 6%
ID Infineon Technologies Dresden: 3 patents #40 of 150Top 30%
BG Bundesdruckerei Gmbh: 1 patents #100 of 183Top 55%
📍 Munich, NY: #7 of 42 inventorsTop 20%
Overall (All Time): #159,481 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Showing 1–25 of 25 patents

Patent #TitleCo-InventorsDate
12362191 Methods and devices related to radio frequency devices Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss +3 more 2025-07-15
12112992 Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component Daniel Porwol, Thomas Fischer, Anton Steltenpohl 2024-10-08
11948802 Methods and devices related to radio frequency devices Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss +3 more 2024-04-02
11605572 Electronic component with semiconductor die having a low ohmic portion with an active area and a high ohmic portion on a dielectric layer Daniel Porwol, Thomas Fischer, Anton Steltenpohl 2023-03-14
11217453 Methods and devices related to radio frequency devices Hans Taddiken, Christian Butschkow, Andrea Cattaneo, Henning Feick, Dominik Heiss +3 more 2022-01-04
10800201 Security object having a dynamic and static window security feature and method for production Simone Zernicek, Andreas Bosien, Michael Knebel, Andre Leopold, Ulrich Schneider 2020-10-13
10615029 Device and method for manufacturing the device Christoph Kadow 2020-04-07
9659877 Shielding device Winfried Bakalski, Bernd Eisener, Markus Zannoth 2017-05-23
9165828 Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device Gabriele Bettineschi, Wolfgang Walter, Michael Schrenk, Hubert Werthmann 2015-10-20
9159620 Semiconductor structure and method for making same Gunther Mackh, Rainer Leuschner 2015-10-13
8822329 Method for making conductive interconnects Rainer Leuschner, Gunther Mackh 2014-09-02
8815743 Through substrate via semiconductor components and methods of formation thereof Albert Birner, Uwe Hoeckele, Thomas Kunstmann 2014-08-26
8697574 Through substrate features in semiconductor substrates Gunther Mackh, Rainer Leuschner 2014-04-15
8659118 Semiconductor device comprising a fuse structure and a method for manufacturing such semiconductor device Gabriele Bettineschi, Wolfgang Walter, Michael Schrenk, Hubert Werthmann 2014-02-25
8513782 Shielding device Winfried Bakalski, Bernd Eisener, Markus Zannoth 2013-08-20
8461655 Micromechanical sound transducer having a membrane support with tapered surface Wolfgang Klein, Stefan Barzen, Mohsin Nawaz, Wolfgang Friza, Xu Kang Cheng +1 more 2013-06-11
8399936 Through substrate via semiconductor components Albert Birner, Uwe Hoeckele, Thomas Kunstmann 2013-03-19
8227340 Method for producing a copper connection between two sides of a substrate Thorsten Obernhuber, Albert Birner, Georg Ehrentraut 2012-07-24
D659718 Front cover of a pump 2012-05-15
D659715 Front cover of a pump 2012-05-15
7999358 Shielding device Winfried Bakalski, Bernd Eisener, Markus Zannoth 2011-08-16
7772123 Through substrate via semiconductor components Albert Birner, Uwe Hoeckele, Thomas Kunstmann 2010-08-10
7395587 Apparatus for controlling a compression zone in a compressively shrinking fabric web Frank Catallo 2008-07-08
7176128 Method for fabrication of a contact structure Carsten Ahrens, Jakob Huber 2007-02-13
6380094 Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuits Rainer Braun 2002-04-30