| 12476176 |
Glass core substrate printed circuit board for warpage reduction |
Carlton Hanna, Eduardo De Mesa, Abdallah Bacha, Lizabeth Keser |
2025-11-18 |
|
| 12439616 |
Integrated circuit package redistribution layers with metal-insulator-metal (MIM) capacitors |
David O'Sullivan, Bernd Waidhas, Horst Baumeister |
2025-10-07 |
|
| 12431424 |
Buried power rails integrated with decoupling capacitance |
Bernd Waidhas, Harald Gossner, Wolfgang Molzer, Michael Langenbuch, Martin Ostermayr +3 more |
2025-09-30 |
|
| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Thomas Wagner, Andreas Wolter, Bernd Waidhas |
2025-09-02 |
|
| 12394726 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Bernd Waidhas |
2025-08-19 |
|
| 12382712 |
Semiconductor dies and devices with frontside and backside coils for inductive coupling |
Peter Baumgartner, Joachim Assenmacher, Walther Lutz, Martin Ostermayr |
2025-08-05 |
|
| 12374625 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-07-29 |
|
| 12347796 |
Semiconductor dies and devices with a coil for inductive coupling |
Martin Ostermayr, Walther Lutz, Joachim Assenmacher |
2025-07-01 |
|
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Thomas Wagner, Andreas Wolter, Bernd Waidhas |
2025-06-24 |
|
| 12249553 |
Thermal contacts at periphery of integrated circuit packages |
Sonja Koller, Vishnu Prasad |
2025-03-11 |
|
| 12243828 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-03-04 |
|
| 12243856 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Richard Patten, Bernd Waidhas |
2025-03-04 |
|
| 12211796 |
Microelectronic assemblies having topside power delivery structures |
Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser |
2025-01-28 |
|
| 12191571 |
Antenna with graded dielectirc and method of making the same |
Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin |
2025-01-07 |
|
| 12125815 |
Assembly of 2XD module using high density interconnect bridges |
Bernd Waidhas, Andreas Wolter, Thomas Wagner |
2024-10-22 |
$18,859,000 |
| 12080655 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Bernd Waidhas |
2024-09-03 |
$14,017,000 |
| 12057411 |
Stress relief die implementation |
Stephan Stoeckl, Wolfgang Molzer, Bernd Waidhas |
2024-08-06 |
$17,070,000 |
| 11955462 |
Package stacking using chip to wafer bonding |
Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more |
2024-04-09 |
$27,197,000 |
| 11877403 |
Printed wiring-board islands for connecting chip packages and methods of assembling same |
Sonja Koller, Bernd Waidhas |
2024-01-16 |
$42,805,000 |
| 11764187 |
Semiconductor packages, and methods for forming semiconductor packages |
Bernd Waidhas, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more |
2023-09-19 |
$20,015,000 |
| 11735570 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Richard Patten, Bernd Waidhas |
2023-08-22 |
$16,803,000 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Thomas Wagner, Klaus Reingruber, Bernd Waidhas, Andreas Wolter |
2022-10-11 |
$16,542,000 |
| 11456116 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same |
Andreas Augustin, Bernd Waidhas, Sonja Koller, Reinhard Mahnkopf |
2022-09-27 |
$23,391,000 |
| 11424209 |
Wafer level package structure with internal conductive layer |
Sven Albers, Klaus Reingruber, Christian Geissler, Richard Patten |
2022-08-23 |
$15,804,000 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Andreas Wolter, Stephan Stoeckl +2 more |
2022-06-28 |
$15,065,000 |
