Issued Patents All Time
Showing 25 most recent of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431424 | Buried power rails integrated with decoupling capacitance | Bernd Waidhas, Harald Gossner, Wolfgang Molzer, Michael Langenbuch, Martin Ostermayr +3 more | 2025-09-30 |
| 12406925 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Thomas Wagner, Andreas Wolter, Bernd Waidhas | 2025-09-02 |
| 12394726 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Gianni SIGNORINI, Bernd Waidhas | 2025-08-19 |
| 12382712 | Semiconductor dies and devices with frontside and backside coils for inductive coupling | Peter Baumgartner, Joachim Assenmacher, Walther Lutz, Martin Ostermayr | 2025-08-05 |
| 12374625 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-07-29 |
| 12347796 | Semiconductor dies and devices with a coil for inductive coupling | Martin Ostermayr, Walther Lutz, Joachim Assenmacher | 2025-07-01 |
| 12341096 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Thomas Wagner, Andreas Wolter, Bernd Waidhas | 2025-06-24 |
| 12249553 | Thermal contacts at periphery of integrated circuit packages | Sonja Koller, Vishnu Prasad | 2025-03-11 |
| 12243828 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-03-04 |
| 12243856 | Fan out packaging pop mechanical attach method | David O'Sullivan, Richard Patten, Bernd Waidhas | 2025-03-04 |
| 12211796 | Microelectronic assemblies having topside power delivery structures | Bernd Waidhas, Carlton Hanna, Stephen L. Morein, Lizabeth Keser | 2025-01-28 |
| 12191571 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Bernd Waidhas, Andreas Augustin | 2025-01-07 |
| 12125815 | Assembly of 2XD module using high density interconnect bridges | Bernd Waidhas, Andreas Wolter, Thomas Wagner | 2024-10-22 |
| 12080655 | Method to implement wafer-level chip-scale packages with grounded conformal shield | Gianni SIGNORINI, Bernd Waidhas | 2024-09-03 |
| 12057411 | Stress relief die implementation | Stephan Stoeckl, Wolfgang Molzer, Bernd Waidhas | 2024-08-06 |
| 11955462 | Package stacking using chip to wafer bonding | Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2024-04-09 |
| 11877403 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Sonja Koller, Bernd Waidhas | 2024-01-16 |
| 11764187 | Semiconductor packages, and methods for forming semiconductor packages | Bernd Waidhas, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more | 2023-09-19 |
| 11735570 | Fan out packaging pop mechanical attach method | David O'Sullivan, Richard Patten, Bernd Waidhas | 2023-08-22 |
| 11469213 | Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics | Thomas Wagner, Klaus Reingruber, Bernd Waidhas, Andreas Wolter | 2022-10-11 |
| 11456116 | Magnetic coils in locally thinned silicon bridges and methods of assembling same | Andreas Augustin, Bernd Waidhas, Sonja Koller, Reinhard Mahnkopf | 2022-09-27 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Christian Geissler, Richard Patten | 2022-08-23 |
| 11374323 | Patch antennas stitched to systems in packages and methods of assembling same | Andreas Augustin, Sonja Koller, Bernd Waidhas, Andreas Wolter, Stephan Stoeckl +2 more | 2022-06-28 |
| 11270941 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Thomas Wagner, Andreas Wolter, Bernd Waidhas | 2022-03-08 |
| 11239199 | Package stacking using chip to wafer bonding | Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter, Marc Dittes +1 more | 2022-02-01 |