Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243856 | Fan out packaging pop mechanical attach method | Georg Seidemann, Richard Patten, Bernd Waidhas | 2025-03-04 |
| 11735570 | Fan out packaging pop mechanical attach method | Georg Seidemann, Richard Patten, Bernd Waidhas | 2023-08-22 |
| 11380616 | Fan out package-on-package with adhesive die attach | Bernd Waidhas, Thomas J. Huber | 2022-07-05 |
| 9646856 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Thorsten Meyer, Klaus Reingruber | 2017-05-09 |
| 9111947 | Chip arrangement with a recessed chip housing region and a method for manufacturing the same | Thorsten Meyer | 2015-08-18 |
| 9064883 | Chip with encapsulated sides and exposed surface | Thorsten Meyer, Klaus Reingruber | 2015-06-23 |
| 8786105 | Semiconductor device with chip having low-k-layers | Thorsten Meyer, Sven Albers, Christian Geissler, Andreas Wolter, Markus Brunnbauer +2 more | 2014-07-22 |