Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12243856 | Fan out packaging pop mechanical attach method | David O'Sullivan, Georg Seidemann, Bernd Waidhas | 2025-03-04 |
| 12237305 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2025-02-25 |
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2024-04-09 |
| 11735570 | Fan out packaging pop mechanical attach method | David O'Sullivan, Georg Seidemann, Bernd Waidhas | 2023-08-22 |
| 11527507 | Microelectronic packages with high integration microelectronic dice stack | — | 2022-12-13 |
| 11424209 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2022-08-23 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2022-02-01 |
| 10910347 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Zhicheng Ding | 2021-02-02 |
| 10872881 | Microelectronic packages with high integration microelectronic dice stack | — | 2020-12-22 |
| 10854590 | Semiconductor die package with more than one hanging die | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2020-12-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2020-10-27 |
| 10672731 | Wafer level package structure with internal conductive layer | Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler | 2020-06-02 |
| 10622333 | Microelectronic packages with high integration microelectronic dice stack | — | 2020-04-14 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more | 2019-09-10 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, John G. Meyers, Zhicheng Ding | 2019-08-27 |
| 10249598 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2019-04-02 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more | 2019-02-19 |
| 9972601 | Integrated circuit package having wirebonded multi-die stack | Thorsten Meyer, Pauli Jaervinen | 2018-05-15 |
| 9859255 | Electronic device package | Jh Yoon, Yong She, Mao Guo | 2018-01-02 |
| 9248352 | Visual adjustable alignment system | — | 2016-02-02 |
| 5917326 | Guidance system for a moving person | Bernard A. Gonzalez | 1999-06-29 |
| D408878 | Blade-type golf putter head | — | 1999-04-27 |
| 5764060 | Guidance system for a moving person | Bernard A. Gonzalez | 1998-06-09 |
| D368752 | Mallet-type golf putter head | — | 1996-04-09 |
| D366081 | Blade-type golf putter head | — | 1996-01-09 |