| 12243856 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Georg Seidemann, Bernd Waidhas |
2025-03-04 |
|
| 12237305 |
Integrated circuit package having wirebonded multi-die stack |
Thorsten Meyer, Pauli Jaervinen |
2025-02-25 |
|
| 11955462 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more |
2024-04-09 |
$27,197,000 |
| 11735570 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Georg Seidemann, Bernd Waidhas |
2023-08-22 |
$16,803,000 |
| 11527507 |
Microelectronic packages with high integration microelectronic dice stack |
— |
2022-12-13 |
$11,573,000 |
| 11424209 |
Wafer level package structure with internal conductive layer |
Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler |
2022-08-23 |
$15,804,000 |
| 11239199 |
Package stacking using chip to wafer bonding |
Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more |
2022-02-01 |
$16,992,000 |
| 10910347 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
Yong She, John G. Meyers, Zhicheng Ding |
2021-02-02 |
$28,243,000 |
| 10872881 |
Microelectronic packages with high integration microelectronic dice stack |
— |
2020-12-22 |
|
| 10854590 |
Semiconductor die package with more than one hanging die |
Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler |
2020-12-01 |
|
| 10816742 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more |
2020-10-27 |
|
| 10672731 |
Wafer level package structure with internal conductive layer |
Sven Albers, Klaus Reingruber, Georg Seidemann, Christian Geissler |
2020-06-02 |
|
| 10622333 |
Microelectronic packages with high integration microelectronic dice stack |
— |
2020-04-14 |
|
| 10411000 |
Microelectronic package with illuminated backside exterior |
Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more |
2019-09-10 |
|
| 10396055 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
Yong She, John G. Meyers, Zhicheng Ding |
2019-08-27 |
$17,353,000 |
| 10249598 |
Integrated circuit package having wirebonded multi-die stack |
Thorsten Meyer, Pauli Jaervinen |
2019-04-02 |
$26,887,000 |
| 10209466 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Marc Dittes +2 more |
2019-02-19 |
|
| 9972601 |
Integrated circuit package having wirebonded multi-die stack |
Thorsten Meyer, Pauli Jaervinen |
2018-05-15 |
$21,346,000 |
| 9859255 |
Electronic device package |
Jh Yoon, Yong She, Mao Guo |
2018-01-02 |
$11,729,000 |
| 9248352 |
Visual adjustable alignment system |
— |
2016-02-02 |
|
| 5917326 |
Guidance system for a moving person |
Bernard A. Gonzalez |
1999-06-29 |
$28,934,000 |
| D408878 |
Blade-type golf putter head |
— |
1999-04-27 |
|
| 5764060 |
Guidance system for a moving person |
Bernard A. Gonzalez |
1998-06-09 |
$12,619,000 |
| D368752 |
Mallet-type golf putter head |
— |
1996-04-09 |
|
| D366081 |
Blade-type golf putter head |
— |
1996-01-09 |
|
