Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955462 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2024-04-09 |
| 11239199 | Package stacking using chip to wafer bonding | Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more | 2022-02-01 |
| 10816742 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more | 2020-10-27 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more | 2020-02-04 |
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-11-26 |
| 10411000 | Microelectronic package with illuminated backside exterior | Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more | 2019-09-10 |
| 10403609 | System-in-package devices and methods for forming system-in-package devices | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-09-03 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more | 2019-02-19 |
| 10181439 | Substrate and method for fabrication thereof | Carlo Marbella | 2019-01-15 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more | 2018-10-30 |