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Marc Dittes — 11 Patents

Intel: 10 patents #4,072 of 30,777Top 15%
Infineon Technologies Ag: 1 patents #4,631 of 7,486Top 65%
Regensburg, DE: #213 of 1,384 inventorsTop 20%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Marc Dittes has been granted 11 US patents while listed as an inventor at Intel. The first was granted in 2018 and the most recent in April 2024. Marc Dittes ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Marc Dittes in Regensburg, DE.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11955462 Package stacking using chip to wafer bonding Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more 2024-04-09 $27,197,000
11239199 Package stacking using chip to wafer bonding Georg Seidemann, Klaus Reingruber, Christian Geissler, Sven Albers, Andreas Wolter +1 more 2022-02-01 $16,992,000
10816742 Integrated circuit packages including an optical redistribution layer Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more 2020-10-27
10553538 Semiconductor package having a variable redistribution layer thickness Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more 2020-02-04 $21,361,000
10522485 Electrical device and a method for forming an electrical device Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more 2019-12-31
10490527 Vertical wire connections for integrated circuit package Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more 2019-11-26
10411000 Microelectronic package with illuminated backside exterior Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber, Georg Seidemann +2 more 2019-09-10
10403609 System-in-package devices and methods for forming system-in-package devices Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more 2019-09-03
10209466 Integrated circuit packages including an optical redistribution layer Georg Seidemann, Christian Geissler, Sven Albers, Thomas Wagner, Klaus Reingruber +2 more 2019-02-19
10181439 Substrate and method for fabrication thereof Carlo Marbella 2019-01-15
10115668 Semiconductor package having a variable redistribution layer thickness Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more 2018-10-30

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11