Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152321 | Semiconductor device having a copper pillar interconnect structure | Swee Guan Chan, Eung San Cho, Navas Khan Oratti Kalandar | 2021-10-19 |
| 10937709 | Substrates for semiconductor packages | Kheng-Jin Chan | 2021-03-02 |
| 10181439 | Substrate and method for fabrication thereof | Marc Dittes | 2019-01-15 |
| 10085353 | Solder bridging prevention structures for circuit boards and semiconductor packages | Fabian Schnoy | 2018-09-25 |
| 9387613 | Semiconductor formation arrangement | Ching Yun Tye, Ramasubramanian Natarajan | 2016-07-12 |
| 9343397 | Method of connecting a semiconductor package to a board | — | 2016-05-17 |
| 9082737 | System and method for an electronic package with a fail-open mechanism | Ganesh Vetrivel Periasamy, Woon Yik Yong, Kok Kiat Koo, Christian Arndt, Edward Myers | 2015-07-14 |
| 8816390 | System and method for an electronic package with a fail-open mechanism | Ganesh Vetrivel Periasamy, Kok Kiat Koo, Ai Min Tan | 2014-08-26 |