Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl | 2023-11-14 |
| 11444011 | Semiconductor package with leadframe interconnection structure | Andreas Kucher, Chia-Yen Lee, Shao Ping Wan | 2022-09-13 |
| 11355460 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl | 2022-06-07 |
| 10872848 | Semiconductor package with leadframe interconnection structure | Andreas Kucher, Chia-Yen Lee, Shao Ping Wan | 2020-12-22 |
| 9082737 | System and method for an electronic package with a fail-open mechanism | Carlo Marbella, Ganesh Vetrivel Periasamy, Kok Kiat Koo, Christian Arndt, Edward Myers | 2015-07-14 |