Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Jürgen Schredl, Woon Yik Yong | 2023-11-14 |
| 11699647 | Pre-molded lead frames for semiconductor packages | Balehithlu Manjappaiah Upendra, Romel Solanoy LAZALA, Mohamad Yazid Bin WAGIMAN | 2023-07-11 |
| 11355460 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Jürgen Schredl, Woon Yik Yong | 2022-06-07 |
| 11189592 | Multi-clip structure for die bonding | Balehithlu Manjappaiah Upendra | 2021-11-30 |
| 6597188 | Ground land for singulated ball grid array | Beng Kee Lim, Tuck Chee Albert Loh | 2003-07-22 |
| 6525553 | Ground pin concept for singulated ball grid array | Rufino Ringor, Fortunato Lopez | 2003-02-25 |