Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12211770 | Semiconductor package and lead frame with enhanced device isolation | Kok Kiat Koo | 2025-01-28 |
| 11699647 | Pre-molded lead frames for semiconductor packages | Romel Solanoy LAZALA, Dexter Reynoso, Mohamad Yazid Bin WAGIMAN | 2023-07-11 |
| 11189592 | Multi-clip structure for die bonding | Dexter Reynoso | 2021-11-30 |