Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152321 | Semiconductor device having a copper pillar interconnect structure | Carlo Marbella, Swee Guan Chan, Eung San Cho | 2021-10-19 |
| 10431534 | Package with support structure | Nishant Lakhera, Gilles Montoriol, Trung Q. Duong, Akhilesh Kumar Singh | 2019-10-01 |
| 10147645 | Wafer level chip scale package with encapsulant | Nishant Lakhera, Akhilesh Kumar Singh | 2018-12-04 |
| 9953904 | Electronic component package with heatsink and multiple electronic components | Akhilesh Kumar Singh, Nishant Lakhera | 2018-04-24 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Nishant Lakhera, Boon Yew Low, Akhilesh Kumar Singh | 2018-04-17 |
| 9691637 | Method for packaging an integrated circuit device with stress buffer | Nishant Lakhera, Akhilesh Kumar Singh | 2017-06-27 |
| 9508632 | Apparatus and methods for stackable packaging | Nishant Lakhera, Varughese Mathew, Akhilesh Kumar Singh | 2016-11-29 |