Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325876 | Surface finish for wirebonding | Burton J. Carpenter, Leo M. Higgins, III, Chu-Chung Lee, Tu-Anh N. Tran | 2019-06-18 |
| 10217713 | Semiconductor device attached to an exposed pad | Sheila F. Chopin, Thomas H. Koschmieder | 2019-02-26 |
| 10199339 | Semiconductor structure with sacrificial anode and method for forming | Sheila F. Chopin, Min Ding, Scott S. Roth | 2019-02-05 |
| 10147697 | Bond pad structure for semiconductor device packaging | Rama I. Hegde | 2018-12-04 |
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | Nishant Lakhera, James R. Guajardo, Akhilesh Kumar Singh | 2018-05-22 |
| 9640466 | Packaged semiconductor device with a lead frame and method for forming | Sheila F. Chopin | 2017-05-02 |
| 9508632 | Apparatus and methods for stackable packaging | Navas Khan Oratti Kalandar, Nishant Lakhera, Akhilesh Kumar Singh | 2016-11-29 |
| 9431313 | Integrated circuit carrier coating | Thomas H. Koschmieder | 2016-08-30 |
| 9426884 | System and method for lead frame package degating | Sheila F. Chopin | 2016-08-23 |
| 9412709 | Semiconductor structure with sacrificial anode and passivation layer and method for forming | Sheila F. Chopin, Min Ding, Scott S. Roth | 2016-08-09 |
| 9117756 | Encapsulant with corrosion inhibitor | — | 2015-08-25 |
| 9093383 | Encapsulant for a semiconductor device | Sheila F. Chopin, Leo M. Higgins, III, Chu-Chung Lee | 2015-07-28 |
| 9012263 | Method for treating a bond pad of a package substrate | Burton J. Carpenter, Leo M. Higgins, III | 2015-04-21 |
| 8955388 | Mold compound compatibility test system and methods thereof | Sheila F. Chopin, Leo M. Higgins, III | 2015-02-17 |
| 8853867 | Encapsulant for a semiconductor device | Sheila F. Chopin, Leo M. Higgins, III, Chu-Chung Lee | 2014-10-07 |
| 8836110 | Heat spreader for use within a packaged semiconductor device | Sheila F. Chopin | 2014-09-16 |
| 8586474 | Method to form a via | Ritwik Chatterjee, Eddie Acosta, Sam S. Garcia | 2013-11-19 |
| 8394713 | Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer | — | 2013-03-12 |
| 8168468 | Method of making a semiconductor device including a bridgeable material | Sam S. Garcia, Tushar P. Merchant | 2012-05-01 |
| 8003517 | Method for forming interconnects for 3-D applications | Eddie Acosta, Ritwik Chatterjee, Sam S. Garcia | 2011-08-23 |
| 7993971 | Forming a 3-D semiconductor die structure with an intermetallic formation | Ritwik Chatterjee, Eddic Acosta | 2011-08-09 |
| 7932175 | Method to form a via | Ritwik Chatterjee, Eddie Acosta, Sam S. Garcia | 2011-04-26 |
| 7807572 | Micropad formation for a semiconductor | Eddie Acosta, Ritwik Chatterjee, Sam S. Garcia | 2010-10-05 |
| 7717060 | Controlled electroless plating | Steven M. Hues, Michael L. Lovejoy | 2010-05-18 |
| 7572723 | Micropad for bonding and a method therefor | Eddie Acosta, Ritwik Chatterjee, Sam S. Garcia | 2009-08-11 |