Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | Nishant Lakhera, Varughese Mathew, Akhilesh Kumar Singh | 2018-05-22 |
| 9087702 | Edge coupling of semiconductor dies | Tim V. Pham, Michael B. McShane, Perry H. Pelley, Andrew C. Russell | 2015-07-21 |
| 8957510 | Using an integrated circuit die configuration for package height reduction | Tim V. Pham, Michael B. McShane | 2015-02-17 |