Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415305 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Sheila F. Chopin, Boon Yew Low | 2025-09-16 |
| 11908784 | Packaged semiconductor device assembly | Akhilesh Kumar Singh, Andrew Jefferson Mawer, Chee Seng Foong, Nihaar N. Mahatme | 2024-02-20 |
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Sheila F. Chopin, Boon Yew Low | 2023-10-17 |
| 11270972 | Package with conductive underfill ground plane | Akhilesh Kumar Singh, Chee Seng Foong | 2022-03-08 |
| 11189557 | Hybrid package | Akhilesh Kumar Singh, Chee Seng Foong | 2021-11-30 |
| 10431534 | Package with support structure | Gilles Montoriol, Trung Q. Duong, Akhilesh Kumar Singh, Navas Khan Oratti Kalandar | 2019-10-01 |
| 10217698 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Rama I. Hegde | 2019-02-26 |
| 10211184 | Apparatus and methods for multi-die packaging | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2019-02-19 |
| 10147645 | Wafer level chip scale package with encapsulant | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2018-12-04 |
| 9978614 | Structure and method to minimize warpage of packaged semiconductor devices | James R. Guajardo, Varughese Mathew, Akhilesh Kumar Singh | 2018-05-22 |
| 9953904 | Electronic component package with heatsink and multiple electronic components | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2018-04-24 |
| 9947614 | Packaged semiconductor device having bent leads and method for forming | Navas Khan Oratti Kalandar, Boon Yew Low, Akhilesh Kumar Singh | 2018-04-17 |
| 9691637 | Method for packaging an integrated circuit device with stress buffer | Navas Khan Oratti Kalandar, Akhilesh Kumar Singh | 2017-06-27 |
| 9559077 | Die attachment for packaged semiconductor device | Akhilesh Kumar Singh, Rama I. Hegde | 2017-01-31 |
| 9508632 | Apparatus and methods for stackable packaging | Navas Khan Oratti Kalandar, Varughese Mathew, Akhilesh Kumar Singh | 2016-11-29 |