Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12415305 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Nishant Lakhera, Boon Yew Low | 2025-09-16 |
| 11787097 | Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes | Nishant Lakhera, Boon Yew Low | 2023-10-17 |
| 10217713 | Semiconductor device attached to an exposed pad | Thomas H. Koschmieder, Varughese Mathew | 2019-02-26 |
| 10199339 | Semiconductor structure with sacrificial anode and method for forming | Min Ding, Varughese Mathew, Scott S. Roth | 2019-02-05 |
| 9640466 | Packaged semiconductor device with a lead frame and method for forming | Varughese Mathew | 2017-05-02 |
| 9426884 | System and method for lead frame package degating | Varughese Mathew | 2016-08-23 |
| 9412709 | Semiconductor structure with sacrificial anode and passivation layer and method for forming | Min Ding, Varughese Mathew, Scott S. Roth | 2016-08-09 |
| 9111952 | Semiconductor device | Leo M. Higgins, III | 2015-08-18 |
| 9093383 | Encapsulant for a semiconductor device | Varughese Mathew, Leo M. Higgins, III, Chu-Chung Lee | 2015-07-28 |
| 8955388 | Mold compound compatibility test system and methods thereof | Varughese Mathew, Leo M. Higgins, III | 2015-02-17 |
| 8853867 | Encapsulant for a semiconductor device | Varughese Mathew, Leo M. Higgins, III, Chu-Chung Lee | 2014-10-07 |
| 8836110 | Heat spreader for use within a packaged semiconductor device | Varughese Mathew | 2014-09-16 |
| 7803662 | Warpage control using a package carrier assembly | Yuan Yuan | 2010-09-28 |
| 7215014 | Solderable metal finish for integrated circuit package leads and method for forming | Peng Su, Nhat Vo | 2007-05-08 |
| 7172927 | Warpage control of array packaging | Yuan Yuan | 2007-02-06 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor | Susan H. Downey, Peter R. Harper, Sohrab Safai, Tu-Anh N. Tran, Alan H. Woosley | 2006-03-21 |
| 6998952 | Inductive device including bond wires | Yaping Zhou, Susan H. Downey, Tu-Anh N. Tran, Alan H. Woosley, Peter R. Harper +1 more | 2006-02-14 |