Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515034 | Bond pad having a trench and method for forming | David B. Clegg, Tu-Anh N. Tran | 2016-12-06 |
| 9111755 | Bond pad and passivation layer having a gap and method for forming | Tu-Anh N. Tran, David B. Clegg | 2015-08-18 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor | Susan H. Downey, Sheila F. Chopin, Peter R. Harper, Tu-Anh N. Tran, Alan H. Woosley | 2006-03-21 |
| 6971929 | Modular high density connector | Carl Rodney Bunke, Chris McDonald, Rene A. Mosquera | 2005-12-06 |
| 6879028 | Multi-die semiconductor package | Mark A. Gerber, Dae Young Hong | 2005-04-12 |
| 6508672 | Joints for filter connector | — | 2003-01-21 |
| 6328615 | Contact formed of joined pieces | — | 2001-12-11 |
| 6325669 | Electrical connector sealing system | — | 2001-12-04 |
| 5572066 | Lead-on-chip semiconductor device and method for its fabrication | Michael C. Przano | 1996-11-05 |
| 4494305 | Contact extraction tool | — | 1985-01-22 |