Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7626276 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Kevin J. Hess, James W. Miller, Cheng Choi Yong | 2009-12-01 |
| 7241636 | Method and apparatus for providing structural support for interconnect pad while allowing signal conductance | Kevin J. Hess, James W. Miller, Cheng Choi Yong | 2007-07-10 |
| 7138328 | Packaged IC using insulated wire | Peter R. Harper | 2006-11-21 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor | Sheila F. Chopin, Peter R. Harper, Sohrab Safai, Tu-Anh N. Tran, Alan H. Woosley | 2006-03-21 |
| 6998952 | Inductive device including bond wires | Yaping Zhou, Sheila F. Chopin, Tu-Anh N. Tran, Alan H. Woosley, Peter R. Harper +1 more | 2006-02-14 |
| 6921979 | Semiconductor device having a bond pad and method therefor | Peter R. Harper, Kevin J. Hess, Michael V. Leoni, Tu-Anh N. Tran | 2005-07-26 |
| 6846717 | Semiconductor device having a wire bond pad and method therefor | James W. Miller, Geoffrey B. Hall | 2005-01-25 |
| 6717270 | Integrated circuit die I/O cells | Harold Downey, James W. Miller | 2004-04-06 |
| 6614091 | Semiconductor device having a wire bond pad and method therefor | James W. Miller, Geoffrey B. Hall | 2003-09-02 |
| 5615827 | Flux composition and corresponding soldering method | Roy Lynn Arldt, Harry J. Golden, Issa S. Mahmoud, Clement A. Okoro, James Spalik | 1997-04-01 |
| 5531838 | Flux composition and corresponding soldering method | Roy Lynn Arldt, Harry J. Goldlen, Issa S. Mahmoud, Clement A. Okoro, James Spalik | 1996-07-02 |