| 6921015 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
William E. Bernier, Donald W. Henderson, Isabelle Paquin |
2005-07-26 |
| 6585150 |
Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
William E. Bernier, Donald W. Henderson, Isabelle Paquin |
2003-07-01 |
| 6550667 |
Flux composition and soldering method for high density arrays |
William E. Bernier, Donald W. Henderson |
2003-04-22 |
| 6468363 |
Composition for increasing activity of a no-clean flux |
Donald W. Henderson |
2002-10-22 |
| 6217671 |
Composition for increasing activity of a no-clean flux |
Donald W. Henderson |
2001-04-17 |
| 5615827 |
Flux composition and corresponding soldering method |
Roy Lynn Arldt, Susan H. Downey, Harry J. Golden, Issa S. Mahmoud, Clement A. Okoro |
1997-04-01 |
| 5531838 |
Flux composition and corresponding soldering method |
Roy Lynn Arldt, Susan H. Downey, Harry J. Goldlen, Issa S. Mahmoud, Clement A. Okoro |
1996-07-02 |
| 5532024 |
Method for improving the adhesion of polymeric adhesives to nickel surfaces |
Steven F. Arndt, Luis J. Matienzo, Irving Memis, Tien Y. Wu |
1996-07-02 |
| 4896817 |
Flux composition and method of decreasing tin content in lead/tin solder joints |
Randy William Snyder |
1990-01-30 |
