Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6558981 | Method for making an encapsulated semiconductor chip module | Miguel A. Jimarez, Marybeth Perrino, Son K. Tran | 2003-05-06 |
| 6403882 | Protective cover plate for flip chip assembly backside | William T. Chen, Michael A. Gaynes, Eric A. Johnson | 2002-06-11 |
| 6246124 | Encapsulated chip module and method of making same | Miguel A. Jimarez, Marybeth Perrino, Son K. Tran | 2001-06-12 |
| 6226187 | Integrated circuit package | David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Patrick Robert Zippetelli | 2001-05-01 |
| 6084299 | Integrated circuit package including a heat sink and an adhesive | David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Patrick Robert Zippetelli | 2000-07-04 |
| 5574630 | Laminated electronic package including a power/ground assembly | John S. Kresge, David N. Light | 1996-11-12 |
| 5532024 | Method for improving the adhesion of polymeric adhesives to nickel surfaces | Steven F. Arndt, Luis J. Matienzo, Irving Memis, James Spalik | 1996-07-02 |
| 5491610 | Electronic package having active means to maintain its operating temperature constant | Lawrence S. Mok, Sampath Purushothaman, Bahgat Sammakia, Janusz S. Wilczynski | 1996-02-13 |
| 5442144 | Multilayered circuit board | William T. Chen, Thomas P. Gall, James R. Wilcox | 1995-08-15 |
| 5359767 | Method of making multilayered circuit board | William T. Chen, Thomas P. Gall, James R. Wilcox | 1994-11-01 |