| 6226187 |
Integrated circuit package |
David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu |
2001-05-01 |
| 6084299 |
Integrated circuit package including a heat sink and an adhesive |
David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu |
2000-07-04 |
| 6046911 |
Dual substrate package assembly having dielectric member engaging contacts at only three locations |
David W. Dranchak, Robert Kelleher, David P. Pagnani |
2000-04-04 |
| 5953214 |
Dual substrate package assembly coupled to a conducting member |
David W. Dranchak, Robert Kelleher, David P. Pagnani |
1999-09-14 |
| 5378306 |
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
Michael J. Cibulsky, Konstantinos I. Papathomas, William J. Summa, David W. Wang |
1995-01-03 |
| 5288542 |
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
Michael J. Cibulsky, Konstantinos I. Papathomas, William J. Summa, David W. Wang |
1994-02-22 |
