DW

David W. Wang

IBM: 26 patents #4,008 of 70,183Top 6%
CT Chipmos Technologies: 11 patents #9 of 99Top 10%
Schlumberger Technology: 10 patents #621 of 7,293Top 9%
FI Fibera: 9 patents #2 of 6Top 35%
AC American Cyanamid: 7 patents #203 of 1,554Top 15%
C( Chipmos Technologies (Bermuda): 5 patents #14 of 49Top 30%
CF Cornell Research Foundation: 1 patents #802 of 1,638Top 50%
SN Ss8 Networks: 1 patents #4 of 19Top 25%
Overall (All Time): #33,957 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 25 most recent of 65 patents

Patent #TitleCo-InventorsDate
9307676 Thermally enhanced electronic package Tzu-Hsin Huang, Yu-Ting Yang, Hung-Hsin Liu, An-Hong Liu, Geng-Shin Shen +1 more 2016-04-05
8752635 Downhole wet mate connection Michael Hui Du, Gary L. Rytlewski, David Verzwyvelt 2014-06-17
8469109 Deformable dart and method Gary L. Rytlewski 2013-06-25
8338935 Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same An-Hong Liu 2012-12-25
8269351 Multi-chip stack package structure An-Hong Liu, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee 2012-09-18
8269352 Multi-chip stack package structure An-Hong Liu, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee 2012-09-18
8264068 Multi-chip stack package structure An-Hong Liu, Hsiang-Ming Huang, Jar-Dar Yang, Yi-Chang Lee 2012-09-11
8220533 Downhole piezoelectric devices Colin Longfield, Gary L. Rytlewski 2012-07-17
7981725 Fabricating process of a chip package structure Geng-Shin Shen 2011-07-19
7973310 Semiconductor package structure and method for manufacturing the same An-Hong Liu, Hao-Yin Tsai, Hsiang-Ming Huang, Yi-Chang Lee, Shu-Ching Ho 2011-07-05
7960214 Chip package Geng-Shin Shen 2011-06-14
7866708 Joining tubular members Craig D. Johnson, Matthew R. Hackworth, Michael Dean Langlais, Laurent Alteirac, Stephane J. Virally +5 more 2011-01-11
7847414 Chip package structure Geng-Shin Shen 2010-12-07
7798212 System and method for forming downhole connections Victor M. Bolze, Rex Mennem, David Verzwyvelt 2010-09-21
7749806 Fabricating process of a chip package structure Geng-Shin Shen 2010-07-06
7638880 Chip package Geng-Shin Shen 2009-12-29
7493959 Joining tubular members Craig D. Johnson, Matthew R. Hackworth, Michael Dean Langlais, Laurent Alteirac, Stephane J. Virally +5 more 2009-02-24
7363974 Gravel packing a well Bruno Khan, Michael Dean Langlais 2008-04-29
7272210 System and method for voice organizer message delivery Sherry Ling Chuang, Sudhir Parikh, Jaime Alberto Diamand 2007-09-18
7243715 Mesh screen apparatus and method of manufacture Colin Price-Smith 2007-07-17
7147054 Gravel packing a well Bruno Khan, Michael Dean Langlais 2006-12-12
7139295 Tunable wavelength locker, tunable wavelength spectrum monitor, and relative wavelength measurement system John Tsai 2006-11-21
7116846 Athermal fiber Bragg grating Joseph A. Methe, Pey Schuan Jian, Peiti Su, John Tsai 2006-10-03
7027136 Structure analysis and defect detection system John Tsai 2006-04-11
6972665 Haptic reconfigurable dashboard system Kevin Tuer 2005-12-06