Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9307676 | Thermally enhanced electronic package | Yu-Ting Yang, Hung-Hsin Liu, An-Hong Liu, Geng-Shin Shen, David W. Wang +1 more | 2016-04-05 |
| 8564954 | Thermally enhanced electronic package | Yu-Ting Yang, Hung-Hsin Liu, An-Hong Liu, Geng-Shin Shen, Wei David Wang +1 more | 2013-10-22 |
| 6952053 | Metal bond pad for integrated circuits allowing improved probing ability of small pads | Liming Tsau, Vincent Chen | 2005-10-04 |
| 6406209 | Upper lid alignment apparatus for hatchback reaction cabin | Chin-Kun Liu, Pang-Cheng Liu, Bruse Lee | 2002-06-18 |
| 5942041 | Non-sticking semi-conductor wafer clamp and method of making same | Yung-Tsun Lo, Hua-Jen Tseng, Pei Wei Tsai | 1999-08-24 |
| 5892232 | Arc chamber for ion implanter | Pei Wei Tsai, Hua-Jen Tseng, Min Lin | 1999-04-06 |