Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12216153 | Semiconductor product with edge integrity detection structure | Xiaoming Li, Andy Brotman | 2025-02-04 |
| 12191243 | Cantilevered power planes to provide a return current path for high-speed signals | Arun Ramakrishnan, Dharmendra Saraswat, Reza Sharifi, Sam Ziqun Zhao, Sam Karikalan +1 more | 2025-01-07 |
| 12068232 | Integrated circuit package with serpentine conductor and method of making | Michael Yee-Chih Wang, Cheng-Chung Lee, Joon Lee, Reza Sharifi, Junfei Zhu | 2024-08-20 |
| 11906802 | Photonics integration in semiconductor packages | Mayank Mayukh, Sam Ziqun Zhao, Sam Karikalan, Reza Sharifi, Arun Ramakrishnan +1 more | 2024-02-20 |
| 11049829 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Edward Law, Andy Brotman | 2021-06-29 |
| 10629504 | Die edge crack and delamination detection | Ennis T. Ogawa, Yusang Lin | 2020-04-21 |
| 10504862 | Redistribution metal and under bump metal interconnect structures and method | Sam Ziqun Zhao, Edward Law, Andy Brotman | 2019-12-10 |
| 9741667 | Integrated circuit with die edge assurance structure | Rong Zeng | 2017-08-22 |
| 8106476 | Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity | Robert I. Wu, Robert Lutze, Jung Wang, Voon Yean Ten | 2012-01-31 |
| 7329955 | Metal-insulator-metal (MIM) capacitor | — | 2008-02-12 |
| 7187015 | High-density metal capacitor using dual-damascene copper interconnect | — | 2007-03-06 |
| 7049204 | High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process | — | 2006-05-23 |
| 7009891 | System and method for one-time programmed memory through direct-tunneling oxide breakdown | Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito | 2006-03-07 |
| 6985387 | System and method for one-time programmed memory through direct-tunneling oxide breakdown | Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito | 2006-01-10 |
| 6960819 | System and method for one-time programmed memory through direct-tunneling oxide breakdown | Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito | 2005-11-01 |
| 6952053 | Metal bond pad for integrated circuits allowing improved probing ability of small pads | Tzu-Hsin Huang, Vincent Chen | 2005-10-04 |
| 6950355 | System and method to screen defect related reliability failures in CMOS SRAMS | Surya Battacharya, Ming-Chung Chen, Guang-Jye Shiau, Henry Chen | 2005-09-27 |
| 6902972 | High-density metal capacitor using dual-damascene copper interconnect | — | 2005-06-07 |
| 6833604 | High density metal capacitor using dual-damascene copper interconnect | — | 2004-12-21 |
| 6803306 | High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process | — | 2004-10-12 |
| 6417094 | Dual-damascene interconnect structures and methods of fabricating same | Bin Zhao | 2002-07-09 |