| 12463319 |
Integrated antennas on side wall of 3D stacked die |
Sam Karikalan, Sam Ziqun Zhao, Mayank Mayukh, Dharmendra Saraswat, Arun Ramakrishnan +1 more |
2025-11-04 |
|
| 12216153 |
Semiconductor product with edge integrity detection structure |
Xiaoming Li, Andy Brotman |
2025-02-04 |
|
| 12191243 |
Cantilevered power planes to provide a return current path for high-speed signals |
Arun Ramakrishnan, Dharmendra Saraswat, Reza Sharifi, Sam Ziqun Zhao, Sam Karikalan +1 more |
2025-01-07 |
|
| 12068232 |
Integrated circuit package with serpentine conductor and method of making |
Michael Yee-Chih Wang, Cheng-Chung Lee, Joon Lee, Reza Sharifi, Junfei Zhu |
2024-08-20 |
|
| 11906802 |
Photonics integration in semiconductor packages |
Mayank Mayukh, Sam Ziqun Zhao, Sam Karikalan, Reza Sharifi, Arun Ramakrishnan +1 more |
2024-02-20 |
|
| 11049829 |
Redistribution metal and under bump metal interconnect structures and method |
Sam Ziqun Zhao, Edward Law, Andy Brotman |
2021-06-29 |
|
| 10629504 |
Die edge crack and delamination detection |
Ennis T. Ogawa, Yusang Lin |
2020-04-21 |
|
| 10504862 |
Redistribution metal and under bump metal interconnect structures and method |
Sam Ziqun Zhao, Edward Law, Andy Brotman |
2019-12-10 |
|
| 9741667 |
Integrated circuit with die edge assurance structure |
Rong Zeng |
2017-08-22 |
$45,155,000 |
| 8106476 |
Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity |
Robert I. Wu, Robert Lutze, Jung Wang, Voon Yean Ten |
2012-01-31 |
$4,697,000 |
| 7329955 |
Metal-insulator-metal (MIM) capacitor |
— |
2008-02-12 |
$11,672,000 |
| 7187015 |
High-density metal capacitor using dual-damascene copper interconnect |
— |
2007-03-06 |
$19,130,000 |
| 7049204 |
High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process |
— |
2006-05-23 |
$8,992,000 |
| 7009891 |
System and method for one-time programmed memory through direct-tunneling oxide breakdown |
Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito |
2006-03-07 |
$11,494,000 |
| 6985387 |
System and method for one-time programmed memory through direct-tunneling oxide breakdown |
Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito |
2006-01-10 |
$9,306,000 |
| 6960819 |
System and method for one-time programmed memory through direct-tunneling oxide breakdown |
Vincent Chen, Henry Chen, Jay Shiau, Surya Battacharya, Akira Ito |
2005-11-01 |
$10,666,000 |
| 6952053 |
Metal bond pad for integrated circuits allowing improved probing ability of small pads |
Tzu-Hsin Huang, Vincent Chen |
2005-10-04 |
$17,605,000 |
| 6950355 |
System and method to screen defect related reliability failures in CMOS SRAMS |
Surya Battacharya, Ming-Chung Chen, Guang-Jye Shiau, Henry Chen |
2005-09-27 |
$13,989,000 |
| 6902972 |
High-density metal capacitor using dual-damascene copper interconnect |
— |
2005-06-07 |
$11,383,000 |
| 6833604 |
High density metal capacitor using dual-damascene copper interconnect |
— |
2004-12-21 |
$12,132,000 |
| 6803306 |
High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process |
— |
2004-10-12 |
$9,567,000 |
| 6417094 |
Dual-damascene interconnect structures and methods of fabricating same |
Bin Zhao |
2002-07-09 |
|
