Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10629504 | Die edge crack and delamination detection | Yusang Lin, Liming Tsau | 2020-04-21 |
| 7888776 | Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss | Honglin Guo, Joe W. McPherson | 2011-02-15 |
| 7566652 | Electrically inactive via for electromigration reliability improvement | Ki-Don Lee, Young-Joon Park | 2009-07-28 |
| 7078817 | Multiple copper vias for integrated circuit metallization | Paul S. Ho, Ki-Don Lee, Hideki Matsuhashi | 2006-07-18 |
| 7033924 | Versatile system for diffusion limiting void formation | Joe W. McPherson | 2006-04-25 |
| 6919639 | Multiple copper vias for integrated circuit metallization and methods of fabricating same | Paul S. Ho, Ki-Don Lee, Hideki Matsuhashi | 2005-07-19 |
| 6737351 | Versatile system for diffusion limiting void formation | Joe W. McPherson | 2004-05-18 |