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Gas turbine blade with cooling flow paths and gas turbine including the same |
— |
2025-09-09 |
| 12140044 |
Blade with improved cooling performance and gas turbine having the same |
— |
2024-11-12 |
| 11965428 |
Airfoil cooling structure, airfoil having airfoil cooling structure, and turbine blade/vane element including airfoil |
Jeong-Ju Kim |
2024-04-23 |
| 11448074 |
Turbine airfoil and turbine including same |
Jung-Shin Park, Ki Hoon Yang, Hyung Hee Cho, Hee Seung Park, Seok Min CHOI +2 more |
2022-09-20 |
| 10927681 |
Gas turbine blade |
— |
2021-02-23 |
| 10930571 |
Test structure and evaluation method for semiconductor photo overlay |
Zack Tran Mai |
2021-02-23 |
| 10378361 |
Gas turbine blade |
Seok Beom Kim |
2019-08-13 |
| 10211093 |
Interconnect structure formed with a high aspect ratio single damascene copper line on a non-damascene via |
Daniel Sawyer, Steven E. English |
2019-02-19 |
| 9431343 |
Stacked damascene structures for microelectronic devices |
Jinseok Kim |
2016-08-30 |
| 9240404 |
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process |
Kwan-Yong Lim, Stanley Seungchul Song |
2016-01-19 |
| 9111779 |
IC resistor formed with integral heatsinking structure |
Young-Joon Park |
2015-08-18 |
| 8865542 |
Embedded polysilicon resistor in integrated circuits formed by a replacement gate process |
Kwan-Yong Lim, Stanley Seungchul Song |
2014-10-21 |
| 7566652 |
Electrically inactive via for electromigration reliability improvement |
Young-Joon Park, Ennis T. Ogawa |
2009-07-28 |
| 7078817 |
Multiple copper vias for integrated circuit metallization |
Paul S. Ho, Ennis T. Ogawa, Hideki Matsuhashi |
2006-07-18 |
| 7031163 |
Mechanical cooling fin for interconnects |
Srikanth Krishnan, William R. Hunter |
2006-04-18 |
| 6919639 |
Multiple copper vias for integrated circuit metallization and methods of fabricating same |
Paul S. Ho, Ennis T. Ogawa, Hideki Matsuhashi |
2005-07-19 |
