Issued Patents All Time
Showing 25 most recent of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9451693 | Electrically conductive adhesive (ECA) for multilayer device interconnects | Rabindra N. Das, Voya R. Markovich, John M. Lauffer, Roy H. Magnuson, Benson Chan | 2016-09-20 |
| 8446707 | Circuitized substrate with low loss capacitive material and method of making same | Rabindra N. Das, Voya R. Markovich, James J. McNamara, Jr. | 2013-05-21 |
| 7560501 | Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic | — | 2009-07-14 |
| 7467742 | Electrically conducting adhesives for via fill applications | Jeffrey D. Gelorme, Sung Kwon Kang, Sampath Purushothaman | 2008-12-23 |
| 7402254 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Mark D. Poliks | 2008-07-22 |
| 7384682 | Electronic package with epoxy or cyanate ester resin encapsulant | — | 2008-06-10 |
| 7321005 | Encapsulant composition and electronic package utilizing same | — | 2008-01-22 |
| 7192997 | Encapsulant composition and electronic package utilizing same | — | 2007-03-20 |
| 7076869 | Solid via layer to layer interconnect | Brian E. Curcio, Donald S. Farquhar, Voya R. Markovich | 2006-07-18 |
| 7064013 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Michael A. Gaynes | 2006-06-20 |
| 7014731 | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same | Donald S. Farquhar, Mark D. Poliks | 2006-03-21 |
| 6996903 | Formation of multisegmented plated through holes | Donald S. Farquhar, Robert M. Japp, John M. Lauffer | 2006-02-14 |
| 6931726 | Method of making and interconnect structure | Christina M. Boyko, Donald S. Farquhar | 2005-08-23 |
| 6929900 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Mark D. Poliks, Jane M. Shaw +2 more | 2005-08-16 |
| 6820332 | Laminate circuit structure and method of fabricating | Robert M. Japp, Voya R. Markovich | 2004-11-23 |
| 6803256 | Cap attach surface modification for improved adhesion | Stephen L. Buchwalter, Hung Manh Dang, Michael A. Gaynes | 2004-10-12 |
| 6794040 | Flowable compositions and use in filling vias and plated through-holes | Gary Johansson | 2004-09-21 |
| 6790473 | Lead protective coating composition, process and structure thereof | Stephen Joseph Fuerniss, Deborah L. Dittrich, David W. Wang | 2004-09-14 |
| 6739027 | Method for producing printed circuit board with embedded decoupling capacitance | John M. Lauffer | 2004-05-25 |
| 6734569 | Die attachment with reduced adhesive bleed-out | Bernd Karl Appelt, Gary Johansson | 2004-05-11 |
| 6734259 | Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom | Robert M. Japp, Cory J. Ruud | 2004-05-11 |
| 6700078 | Formation of multisegmented plated through holes | Donald S. Farquhar, Robert M. Japp, John M. Lauffer | 2004-03-02 |
| 6686539 | Tamper-responding encapsulated enclosure having flexible protective mesh structure | Donald S. Farquhar, Claudius Feger, Voya R. Markovich, Mark D. Poliks, Jane M. Shaw +2 more | 2004-02-03 |
| 6660945 | Interconnect structure and method of making same | Christina M. Boyko, Donald S. Farquhar | 2003-12-09 |
| 6645607 | Method and structure for producing Z-axis interconnection assembly of printed wiring board elements | Brian E. Curcio, Donald S. Farquhar, Mark D. Poliks | 2003-11-11 |