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USPTO Patent Rankings Data through Dec 31, 2025
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Claudius Feger — 52 Patents

IBM: 52 patents #1,623 of 70,183Top 3%
Poughkeepsie, NY: #67 of 1,613 inventorsTop 5%
New York: #1,765 of 115,490 inventorsTop 2%
Overall (All Time): #50,240 of 4,157,543Top 2%
52 Patents All Time
Claudius Feger has been granted 52 US patents while listed as an inventor at IBM. The first was granted in 1989 and the most recent in January 2023. Claudius Feger ranks #50,240 of 4,157,543 US inventors in our database (top 1.2%). Patent records list Claudius Feger in Poughkeepsie, NY, US.

Issued Patents All Time

Showing 1–25 of 52 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11555801 Operation of diagnostic devices involving microchannels and electrodes Jaione Tirapu Azpiroz, Emmanuel Delamarche, Ricardo Luis Ohta, Mathias B. Steiner, Yuksel Temiz 2023-01-17 $4,393,000
11021646 Nanoparticle design for enhanced oil recovery Ronaldo Giro, Mathias B. Steiner 2021-06-01 $4,052,000
10766086 Injection-molded solder (IMS) tool assembly and method of use thereof Bonnie L Glick, Jae-Woong Nah 2020-09-08 $3,136,000
10444184 Operation of diagnostic devices involving microchannels and electrodes Jaione Tirapu Azpiroz, Emmanuel Delamarche, Ricardo Luis Ohta, Mathias B. Steiner, Yuksel Temiz 2019-10-15 $4,653,000
10392555 Nanoparticle design for enhanced oil recovery Ronaldo Giro, Mathias B. Steiner 2019-08-27 $1,335,000
10108762 Tunable miniaturized physical subsurface model for simulation and inversion Lior Horesh, Ulisses T. Mello, Maria J. B. Moura 2018-10-23 $2,704,000
10081015 Trapping at least one microparticle Jaione Tirapu Azpiroz, Emmanuel Delamarche, Yuksel Temiz 2018-09-25 $2,527,000
9962714 Microchannel, microfluidic chip and method for processing microparticles in a fluid flow Jaione Tirapu Azpiroz, Emmanuel Delamarche, Yuksel Temiz 2018-05-08 $5,367,000
9759643 Method and integrated device for analyzing liquid flow and liquid-solid interface interaction Phaedon Avouris, Michael Engel, Ronaldo Giro, Rodrigo Neumann Barros Ferreira, Mathias B. Steiner 2017-09-12 $1,776,000
9310285 Method and integrated device for analyzing liquid flow and liquid-solid interface interaction Phaedon Avouris, Michael Engel, Ronaldo Giro, Rodrigo Neumann Barros Ferreira, Mathias B. Steiner 2016-04-12 $2,843,000
8963340 No flow underfill or wafer level underfill and solder columns Michael A. Gaynes, Jae-Woong Nah, Da-Yuan Shih 2015-02-24 $3,851,000
8938627 Multilayer securing structure and method thereof for the protection of cryptographic keys and code Stefano S. Oggioni, Vincenzo Condorelli 2015-01-20 $6,263,000
8875978 Forming constant diameter spherical metal balls Peter A. Gruber, Mark H. McLeod, Jae-Woong Nah 2014-11-04 $3,955,000
8820612 Injection molded solder process for forming solder bumps on substrates Mark H. McLeod, Jae-Woong Nah, Eric D. Perfecto 2014-09-02 $3,373,000
8636931 Vacuum extrusion method of manufacturing a thermal paste Ijeoma M. Nnebe, Maurice McGlashan-Powell 2014-01-28 $3,630,000
8496159 Injection molded solder process for forming solder bumps on substrates Mark H. McLeod, Jae-Woong Nah, Eric D. Perfecto 2013-07-30 $15,502,000
8408448 Forming constant diameter spherical metal balls Peter A. Gruber, Mark H. McLeod, Jae-Woong Nah 2013-04-02 $8,535,000
8178153 Heat transfer control structures using thermal phonon spectral overlap Maurice McGlashan-Powell, Ijeoma M. Nnebe 2012-05-15 $8,909,000
7981849 Reversible thermal thickening grease Jeffrey D. Gelorme, Sushumna Iruvanti, Rajneesh Kumar, Ijeoma M. Nnebe 2011-07-19 $6,687,000
7951648 Chip-level underfill method of manufacture Nancy C. LaBianca 2011-05-31 $4,283,000
7815968 Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Jon A. Casey, Matteo Flotta +5 more 2010-10-19 $3,706,000
7776993 Underfilling with acid-cleavable acetal and ketal epoxy oligomers Stephen L. Buchwalter, Gareth G. Hougham, Nancy C. LaBianca, Hosadurga Shobha 2010-08-17 $4,695,000
7773220 Method and system for collecting alignment data from coated chips or wafers Nancy C. LaBianca, Steven E. Steen 2010-08-10 $5,029,000
7768005 Physically highly secure multi-chip assembly Vincenzo Condorelli, Kevin C. Gotze, Nihad Hadzic, John U. Knickerbocker, Edmund J. Sprogis 2010-08-03 $4,325,000
7523852 Solder interconnect structure and method using injection molded solder Stephen L. Buchwalter, Peter A. Gruber, Sung Kwon Kang, Paul A. Lauro, Da-Yuan Shih 2009-04-28 $8,592,000