Issued Patents All Time
Showing 25 most recent of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11541472 | Ultrasonic-assisted solder transfer | Jae-Woong Nah, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2023-01-03 |
| 11270966 | Combination polyimide decal with a rigid mold | Jae-Woong Nah, Peter A. Gruber, Paul A. Lauro, Da-Yuan Shih | 2022-03-08 |
| 11110534 | Continuous solder transfer to substrates | Jae-Woong Nah, Peter A. Gruber, Da-Yuan Shih, Paul A. Lauro | 2021-09-07 |
| 10833120 | Injection molded microoptics | Lawrence Jacobowitz, Casimer M. DeCusatis, Peter A. Gruber, Da-Yuan Shih | 2020-11-10 |
| 10490594 | Injection molded microoptics | Lawrence Jacobwitz, Casimer M. DeCusatis, Peter A. Gruber, Da-Yuan Shih | 2019-11-26 |
| 9490408 | Injection molded microoptics | Lawrence Jacobowitz, Casimer M. DeCusatis, Peter A. Gruber, Da-Yuan Shih | 2016-11-08 |
| 8963020 | Process for making stubless printed circuit boards | Russell A. Budd | 2015-02-24 |
| 8541299 | Electrical interconnect forming method | Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2013-09-24 |
| 8476773 | Electrical interconnect structure | Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2013-07-02 |
| 8404981 | Process for making stubless printed circuit boards | Russell A. Budd | 2013-03-26 |
| 8376207 | Micro-fluidic injection molded solder (IMS) | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2013-02-19 |
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson +8 more | 2012-11-20 |
| 8268719 | Sprocket opening alignment process and apparatus for multilayer solder decal | Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2012-09-18 |
| 8242010 | Electrical interconnect forming method | Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2012-08-14 |
| 8227264 | Reworkable electronic device assembly and method | Paul S. Andry, George A. Katopis, John U. Knickerbocker, Stelios G. Tsapepas, Bucknell C. Webb | 2012-07-24 |
| 8162200 | Micro-fluidic injection molded solder (IMS) | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2012-04-24 |
| 8136714 | Micro-fluidic injection molded solder (IMS) | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2012-03-20 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2011-07-19 |
| 7936060 | Reworkable electronic device assembly and method | Paul S. Andry, George A. Katopis, John U. Knickerbocker, Stelios G. Tsapepas, Bucknell C. Webb | 2011-05-03 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Leena Paivikki Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson +8 more | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2011-04-19 |
| 7838954 | Semiconductor structure with solder bumps | Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2010-11-23 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Jon A. Casey, Claudius Feger, Matteo Flotta +5 more | 2010-10-19 |
| 7786001 | Electrical interconnect structure and method | Bruce K. Furman, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2010-08-31 |
| 7776993 | Underfilling with acid-cleavable acetal and ketal epoxy oligomers | Claudius Feger, Gareth G. Hougham, Nancy C. LaBianca, Hosadurga Shobha | 2010-08-17 |