Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314500 | Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson +8 more | 2012-11-20 |
| 8269291 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Kevin K. Chan, Timothy J. Dalton, Christopher V. Jahnes, Jennifer Lund, Kevin Shawn Petraraca +2 more | 2012-09-18 |
| 8187923 | Laser release process for very thin Si-carrier build | Paul S. Andry, Matthew J. Farinelli, Sherif A. Goma, Raymond R. Horton, Edmund J. Sprogis | 2012-05-29 |
| 7943412 | Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters | Kevin K. Chan, Timothy J. Dalton, Christopher V. Jahnes, Jennifer Lund, Kevin S. Petrarca +2 more | 2011-05-17 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers | Luc Belanger, Stephen L. Buchwalter, Ajay P. Giri, Jonathan H. Griffith, Donald W. Henderson +8 more | 2011-04-26 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger, Matteo Flotta +5 more | 2010-10-19 |
| 7615405 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Raymond R. Horton, John U. Knickerbocker, Cornelia K. Tsang, Steven L. Wright | 2009-11-10 |
| 7456046 | Method to create flexible connections for integrated circuits | Russell A. Budd, Chirag S. Patel | 2008-11-25 |
| 7452568 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Gareth G. Hougham, Stephen L. Buchwalter, Jon A. Casey, Claudius Feger, Matteo Flotta +5 more | 2008-11-18 |
| 7282391 | Method for precision assembly of integrated circuit chip packages | Paul S. Andry, Raymond R. Horton, John U. Knickerbocker, Cornelia K. Tsang, Steven L. Wright | 2007-10-16 |
| 7276787 | Silicon chip carrier with conductive through-vias and method for fabricating same | Daniel C. Edelstein, Paul S. Andry, Jon A. Casey, Sherif A. Goma, Raymond R. Horton +9 more | 2007-10-02 |
| 7199450 | Materials and method to seal vias in silicon substrates | Jon A. Casey, Michael Berger, Donald F. Canaperi, Raymond R. Horton, Anurag Jain +2 more | 2007-04-03 |
| 7019402 | Silicon chip carrier with through-vias using laser assisted chemical vapor deposition of conductor | Paul S. Andry, Russell A. Budd, Thomas A. Wassick | 2006-03-28 |
| 6818843 | Microswitch with a micro-electromechanical system | Michael Meixner, Jennifer Lund, Hariklia Deligianni | 2004-11-16 |
| 6593660 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2003-07-15 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel, Christopher V. Jahnes +3 more | 2003-06-10 |
| 6261951 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Barbara Luther, Paul D. Agnello, John P. Hummel, Terence L. Kane, Dirk Manger +3 more | 2001-07-17 |
| 6255217 | Plasma treatment to enhance inorganic dielectric adhesion to copper | Paul D. Agnello, John P. Hummel, Barbara Luther, Anthony K. Stamper | 2001-07-03 |
| 6184121 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel, Christopher V. Jahnes +3 more | 2001-02-06 |
| 5340451 | Process for producing a metal organic polymer combination | Stephen L. Buchwalter, Charles R. Davis, Ronald D. Goldblatt, John E. Heidenreich, III, Sharon L. Nunes +4 more | 1994-08-23 |
| 5133840 | Surface midification of a polyimide | Stephen L. Buchwalter, Terrence R. O'Toole, Richard R. Thomas, Alfred Viehbeck | 1992-07-28 |