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Thinned die stack |
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Bing Dang, Robert J. Polastre |
2013-01-01 |
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Laser release process for very thin Si-carrier build |
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2012-05-29 |
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Techniques for providing decoupling capacitance |
John U. Knickerbocker, Edmund J. Sprogis, Cornelia K. Tsang |
2010-09-07 |
| 7741231 |
Techniques for providing decoupling capacitance |
John U. Knickerbocker, Edmund J. Sprogis, Cornelia K. Tsang |
2010-06-22 |
| 7691669 |
Techniques for providing decoupling capacitance |
John U. Knickerbocker, Edmund J. Sprogis, Cornelia K. Tsang |
2010-04-06 |
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Method for precision assembly of integrated circuit chip packages |
Paul S. Andry, Leena Paivikki Buchwalter, John U. Knickerbocker, Cornelia K. Tsang, Steven L. Wright |
2009-11-10 |
| 7488624 |
Techniques for providing decoupling capacitance |
John U. Knickerbocker, Edmund J. Sprogis, Cornelia K. Tsang |
2009-02-10 |
| 7449067 |
Method and apparatus for filling vias |
Paul S. Andry, Jon A. Casey, Chiraq S. Patel, Edmund J. Sprogis, Brian R. Sundlof |
2008-11-11 |
| 7435627 |
Techniques for providing decoupling capacitance |
John U. Knickerbocker, Edmund J. Sprogis, Cornelia K. Tsang |
2008-10-14 |
| 7282391 |
Method for precision assembly of integrated circuit chip packages |
Paul S. Andry, Leena Paivikki Buchwalter, John U. Knickerbocker, Cornelia K. Tsang, Steven L. Wright |
2007-10-16 |
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Silicon chip carrier with conductive through-vias and method for fabricating same |
Daniel C. Edelstein, Paul S. Andry, Leena Paivikki Buchwalter, Jon A. Casey, Sherif A. Goma +9 more |
2007-10-02 |
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2007-04-03 |
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Ismail C. Noyan, Michael J. Palmer, William Edward Pence |
2004-05-11 |
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TFT LCD active data line repair |
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Common ball-limiting metallurgy for I/O sites |
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2001-12-04 |
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Method of fabricating an electronic package with interconnected chips |
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2001-10-23 |
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2001-09-25 |
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2000-02-29 |
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1999-09-07 |
| 5915462 |
High efficiency thermal interposer |
Bernardo Hernandez, Ismail C. Noyan, Michael J. Palmer |
1999-06-29 |
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1998-12-08 |
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Electronic packaging shaped beam lead fabrication |
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1998-06-23 |
