Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8927087 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2015-01-06 |
| 8617689 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2013-12-31 |
| 8541299 | Electrical interconnect forming method | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2013-09-24 |
| 8541291 | Thermo-compression bonded electrical interconnect structure and method | Jae-Woong Nah | 2013-09-24 |
| 8476773 | Electrical interconnect structure | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2013-07-02 |
| 8241995 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric | Kuan-Neng Chen, Sampath Purushothaman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2012-08-14 |
| 8242010 | Electrical interconnect forming method | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2012-08-14 |
| 8164192 | Thermo-compression bonded electrical interconnect structure | Jae-Woong Nah | 2012-04-24 |
| 8156998 | Patterned metal thermal interface | Sushumna Iruvanti, Paul A. Lauro, Yves Martin, Da-Yuan Shih, Theodore G. van Kessel +1 more | 2012-04-17 |
| 8043893 | Thermo-compression bonded electrical interconnect structure and method | Jae-Woong Nah | 2011-10-25 |
| 8002477 | Devices and methods for side-coupling optical fibers to optoelectronic components | Evan G. Colgan, Fuad E. Doany, Daniel J. Stigliani, Jr. | 2011-08-23 |
| 7978473 | Cooling apparatus with cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Paul A. Lauro +3 more | 2011-07-12 |
| 7952193 | Method and apparatus for deploying a liquid metal thermal interface for chip cooling | Yves Martin, Theodore G. van Kessel | 2011-05-31 |
| 7898076 | Structure and methods of processing for solder thermal interface materials for chip cooling | Madhusudan K. Iyengar, Paul A. Lauro, Yves Martin, Roger R. Schmidt, Da-Yuan Shih +2 more | 2011-03-01 |
| 7868457 | Thermo-compression bonded electrical interconnect structure and method | Jae-Woong Nah | 2011-01-11 |
| 7863070 | Methods for encapsulating microelectromechanical (MEM) devices on a wafer scale | Evan G. Colgan, Christopher V. Jahnes | 2011-01-04 |
| 7855101 | Layer transfer process and functionally enhanced integrated circuits produced thereby | Sampath Purushothaman, Muthumanickam Sankarapandian, Anna W. Topol | 2010-12-21 |
| 7834442 | Electronic package method and structure with cure-melt hierarchy | Kenneth C. Marston, Jiantao Zheng, Jeffrey A. Zitz | 2010-11-16 |
| 7804048 | Structure for cooling a surface | Yves Martin, Theodore G. van Kessel | 2010-09-28 |
| 7786596 | Hermetic seal and reliable bonding structures for 3D applications | Kuan-Neng Chen, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman +1 more | 2010-08-31 |
| 7786001 | Electrical interconnect structure and method | Stephen L. Buchwalter, Peter A. Gruber, Jae-Woong Nah, Da-Yuan Shih | 2010-08-31 |
| 7731079 | Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled | Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Paul A. Lauro +3 more | 2010-06-08 |
| 7694719 | Patterned metal thermal interface | Sushumna Iruvanti, Paul A. Lauro, Yves Martin, Da-Yuan Shih, Theodore G. van Kessel +1 more | 2010-04-13 |
| 7683478 | Hermetic seal and reliable bonding structures for 3D applications | Kuan-Neng Chen, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang, Matthew R. Wordeman +1 more | 2010-03-23 |
| 7537709 | Method for isotropic etching of copper | Emanuel I. Cooper, David L. Rath | 2009-05-26 |