MW

Matthew R. Wordeman

IBM: 54 patents #1,518 of 70,183Top 3%
Infineon Technologies Ag: 2 patents #91 of 446Top 25%
Overall (All Time): #47,640 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 25 most recent of 54 patents

Patent #TitleCo-InventorsDate
10839935 Dynamic redundancy for memory Daniel C. Worledge, John K. DeBrosse, Kotb Jabeur 2020-11-17
10726897 Trimming MRAM sense amp with offset cancellation Thomas M. Maffitt, John K. DeBrosse 2020-07-28
9799386 STT MRAM midpoint reference cell allowing full write John K. DeBrosse 2017-10-24
8928350 Programming the behavior of individual chips or strata in a 3D stack of integrated circuits Liang Pang, Joel A. Silberman 2015-01-06
8828800 Method of forming adaptive interconnect structure having programmable contacts Leland Chang, Albert M. Young 2014-09-09
8586957 Three-terminal cascade switch for controlling static power consumption in integrated circuits Lia Krusin-Elbaum, Dennis M. Newns 2013-11-19
8570088 3D integrated circuit stack-wide synchronization circuit Joel A. Silberman 2013-10-29
8519735 Programming the behavior of individual chips or strata in a 3D stack of integrated circuits Liang Pang, Joel A. Silberman 2013-08-27
8476771 Configuration of connections in a 3D stack of integrated circuits Michael R. Scheuermann, Joel A. Silberman 2013-07-02
8476953 3D integrated circuit stack-wide synchronization circuit Joel A. Silberman 2013-07-02
8466444 Three-terminal cascade switch for controlling static power consumption in integrated circuits Lia Krusin-Elbaum, Dennis M. Newns 2013-06-18
8381156 3D inter-stratum connectivity robustness Michael P. Beakes, Shih-Hsien Lo, Michael R. Scheuermann 2013-02-19
8174841 Adaptive interconnect structure Leland Chang, Albert M. Young 2012-05-08
8143609 Three-terminal cascade switch for controlling static power consumption in integrated circuits Lia Krusin-Elbaum, Dennis M. Newns 2012-03-27
7786596 Hermetic seal and reliable bonding structures for 3D applications Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang +1 more 2010-08-31
7732798 Programmable via structure for three dimensional integration technology Bruce G. Elmegreen, Lia Krusin-Elbaum, Chung H. Lam, Dennis M. Newns, Albert M. Young 2010-06-08
7683478 Hermetic seal and reliable bonding structures for 3D applications Kuan-Neng Chen, Bruce K. Furman, Edmund J. Sprogis, Anna W. Topol, Cornelia K. Tsang +1 more 2010-03-23
7652279 Three-terminal cascade switch for controlling static power consumption in integrated circuits Lia Krusin-Elbaum, Dennis M. Newns 2010-01-26
7646006 Three-terminal cascade switch for controlling static power consumption in integrated circuits Lia Krusin-Elbaum, Dennis M. Newns 2010-01-12
7564729 Differential and hierarchical sensing for memory circuits John E. Barth, Jr., Paul C. Parries, William Robert Reohr 2009-07-21
7545667 Programmable via structure for three dimensional integration technology Bruce G. Elmegreen, Lia Krusin-Elbaum, Chung H. Lam, Dennis M. Newns, Albert M. Young 2009-06-09
7382672 Differential and hierarchical sensing for memory circuits John E. Barth, Jr., Paul C. Parries, William Robert Reohr 2008-06-03
7286385 Differential and hierarchical sensing for memory circuits John E. Barth, Jr., Paul C. Parries, William Robert Reohr 2007-10-23
7194670 Command multiplier for built-in-self-test Jonathan R. Fales, Gregory J. Fredeman, Kevin W. Gorman, Mark D. Jacunski, Toshiaki Kirihata +2 more 2007-03-20
7085180 Method and structure for enabling a redundancy allocation during a multi-bank operation Gregory J. Fredeman, Mark D. Jacunski, Toshiaki Kirihata 2006-08-01