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Early analysis and mitigation of self-heating in design flows |
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2018-06-05 |
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Vertical power budgeting and shifting for three-dimensional integration |
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2013-08-20 |
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Configuration of connections in a 3D stack of integrated circuits |
Joel A. Silberman, Matthew R. Wordeman |
2013-07-02 |
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3D inter-stratum connectivity robustness |
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2013-02-19 |
| 7681169 |
Process for managing complex pre-wired net segments in a VLSI design |
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2010-03-16 |
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Gray scale etching for thin flexible interposer |
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High speed silicon-based lateral junction photodetectors having recessed electrodes and thick oxide to reduce fringing fields |
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Method for conditioning an organic polymeric material |
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Thin interface pellicle for dense arrays of electrical interconnects |
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Detachable high-speed opto-electronic sampling probe |
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1989-07-25 |
