Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9990454 | Early analysis and mitigation of self-heating in design flows | Nagashyamala R. Dhanwada, William W. Dungan, Arun Joseph, Sungjae Lee, Arjen A. Mets +3 more | 2018-06-05 |
| 8516426 | Vertical power budgeting and shifting for three-dimensional integration | Pradip Bose, Gary Dale Carpenter, Michael Stephen Floyd, Eren Kursun, Phillip J. Restle | 2013-08-20 |
| 8476771 | Configuration of connections in a 3D stack of integrated circuits | Joel A. Silberman, Matthew R. Wordeman | 2013-07-02 |
| 8381156 | 3D inter-stratum connectivity robustness | Michael P. Beakes, Shih-Hsien Lo, Matthew R. Wordeman | 2013-02-19 |
| 7681169 | Process for managing complex pre-wired net segments in a VLSI design | Christopher J. Berry, Michael Alexander Bowen, Michael H. Wood | 2010-03-16 |
| 6156484 | Gray scale etching for thin flexible interposer | Ernest Bassous, Gobinda Das, Frank D. Egitto, Natalie B. Feilchenfeld, Elizabeth Foster +4 more | 2000-12-05 |
| 5525828 | High speed silicon-based lateral junction photodetectors having recessed electrodes and thick oxide to reduce fringing fields | Ernest Bassous, Jean-Marc Halbout, Subramanian S. Iyer, Rajiv V. Joshi, Vijay P. Kesan +1 more | 1996-06-11 |
| 5242713 | Method for conditioning an organic polymeric material | Alfred Viehbeck, Stephen L. Buchwalter, William A. Donson, John J. Glenning, Martin J. Goldberg +6 more | 1993-09-07 |
| 5207585 | Thin interface pellicle for dense arrays of electrical interconnects | Herbert P. Byrnes, Jean-Marc Halbout, Eugene Shapiro | 1993-05-04 |
| 4851767 | Detachable high-speed opto-electronic sampling probe | Jean-Marc Halbout, Mark B. Ketchen, Paul A. Moskowitz | 1989-07-25 |