Gobinda Das — 11 Patents at IBM

Gobinda Das has been granted 11 US patents while listed as an inventor at IBM. The first was granted in 1991 and the most recent in March 2025. Gobinda Das ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Gobinda Das in Kanchinakote, NY, IN.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12259850	Space efficient distributed storage systems	—	2025-03-25
11550755	High performance space efficient distributed storage	—	2023-01-10
8524596	Techniques for improving bond pad performance	Frederic Beaulieu, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight +1 more	2013-09-03	$4,698,000
7007380	TFI probe I/O wrap test method	Franco Motika	2006-03-07	$6,870,000
6731128	TFI probe I/O wrap test method	Franco Motika	2004-05-04	$7,309,000
6426636	Wafer probe interface arrangement with nonresilient probe elements and support structure	Steven J. Duda, Paul M. Gaschke, Angelo M. Giaimo, Frederick L. Taber, Jr., John Vetrero	2002-07-30	$10,205,000
6411112	Off-axis contact tip and dense packing design for a fine pitch probe	Steven J. Duda, Paul M. Gaschke	2002-06-25	$16,651,000
6156484	Gray scale etching for thin flexible interposer	Ernest Bassous, Frank D. Egitto, Natalie B. Feilchenfeld, Elizabeth Foster, Stephen Joseph Fuerniss +4 more	2000-12-05	$46,958,000
5973928	Multi-layer ceramic substrate decoupling	Charles J. Blasi, Franco Motika	1999-10-26	$20,157,000
5059553	Metal bump for a thermal compression bond and method for making same	Erich Berndlmaier, Thomas L. Viau	1991-10-22	$12,556,000
5053851	Metal bump for a thermal compression bond and method for making same	Erich Berndlmaier, Thomas L. Viau	1991-10-01	$11,924,000

Gobinda Das — 11 Patents

Issued Patents All Time

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