Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12259850 | Space efficient distributed storage systems | — | 2025-03-25 |
| 11550755 | High performance space efficient distributed storage | — | 2023-01-10 |
| 8524596 | Techniques for improving bond pad performance | Frederic Beaulieu, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight +1 more | 2013-09-03 |
| 7007380 | TFI probe I/O wrap test method | Franco Motika | 2006-03-07 |
| 6731128 | TFI probe I/O wrap test method | Franco Motika | 2004-05-04 |
| 6426636 | Wafer probe interface arrangement with nonresilient probe elements and support structure | Steven J. Duda, Paul M. Gaschke, Angelo M. Giaimo, Frederick L. Taber, Jr., John Vetrero | 2002-07-30 |
| 6411112 | Off-axis contact tip and dense packing design for a fine pitch probe | Steven J. Duda, Paul M. Gaschke | 2002-06-25 |
| 6156484 | Gray scale etching for thin flexible interposer | Ernest Bassous, Frank D. Egitto, Natalie B. Feilchenfeld, Elizabeth Foster, Stephen Joseph Fuerniss +4 more | 2000-12-05 |
| 5973928 | Multi-layer ceramic substrate decoupling | Charles J. Blasi, Franco Motika | 1999-10-26 |
| 5059553 | Metal bump for a thermal compression bond and method for making same | Erich Berndlmaier, Thomas L. Viau | 1991-10-22 |
| 5053851 | Metal bump for a thermal compression bond and method for making same | Erich Berndlmaier, Thomas L. Viau | 1991-10-01 |