Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426636 | Wafer probe interface arrangement with nonresilient probe elements and support structure | Gobinda Das, Steven J. Duda, Paul M. Gaschke, Angelo M. Giaimo, John Vetrero | 2002-07-30 |
| 5977787 | Large area multiple-chip probe assembly and method of making the same | Gobina Das, Paul M. Gaschke, Suryanarayan G. Hegde, Mark R. LaForce, Dale Curtis McHerron +1 more | 1999-11-02 |