Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8524596 | Techniques for improving bond pad performance | Frederic Beaulieu, Gobinda Das, Matthew J. Farinelli, Adreanne Kelly, Samuel McKnight +1 more | 2013-09-03 |
| 6426636 | Wafer probe interface arrangement with nonresilient probe elements and support structure | Gobinda Das, Paul M. Gaschke, Angelo M. Giaimo, Frederick L. Taber, Jr., John Vetrero | 2002-07-30 |
| 6411112 | Off-axis contact tip and dense packing design for a fine pitch probe | Gobinda Das, Paul M. Gaschke | 2002-06-25 |