Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8524596 | Techniques for improving bond pad performance | Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Samuel McKnight +1 more | 2013-09-03 |
| 7273804 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Samuel McKnight, Hiromitsu Miyai +4 more | 2007-09-25 |
| 6960831 | Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad | Lloyd Burrell, Kwong Hon Wong, Samuel McKnight | 2005-11-01 |
| 6864578 | Internally reinforced bond pads | David Angell, Frederic Beaulieu, Takashi Hisada, Samuel McKnight, Hiromitsu Miyai +4 more | 2005-03-08 |